Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 323: Line 323:
 
|6.47
 
|6.47
 
|1.18
 
|1.18
  +
|
  +
|
  +
|-
  +
|Silver chloride
  +
|AgCl
  +
|5.56
  +
|1.32
  +
|
  +
|
  +
|-
  +
|Sodium
  +
|Na
  +
|0.97
  +
|4.8
  +
|
  +
|
  +
|-
  +
|Sodium chloride
  +
|NaCl
  +
|2.17
  +
|1.57
  +
|
  +
|
  +
|-
  +
|Tantalum
  +
|Ta
  +
|16.6
  +
|0.262
  +
|
  +
|
  +
|-
  +
|Tantalum(IV) oxide
  +
|Ta<sub>2</sub>O<sub>5</sub>
  +
|8.2
  +
|0.30
 
|
 
|
 
|
 
|

Revision as of 09:10, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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