Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 50: Line 50:
 
|1.85
  
|1.85
 
|0.543
  
|0.543
  +
|
  +
|
  +
|-
  +
|Boron
  +
|B
  +
|2.54
  +
|0.389
  +
|
  +
|
  +
|-
  +
|Cadmium
  +
|Cd
  +
|8.64
  +
|0.682
  +
|
  +
|
  +
|-
  +
|Cadmium sulfide
  +
|CdS
  +
|4.83
  +
|1.02
  +
|
  +
|
  +
|-
  +
|Cadmium telluride
  +
|CdTe
  +
|5.85
  +
|0.980
 
|
  
|
 
|
  
|

Revision as of 16:20, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table

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