Difference between revisions of "Thermal Evap 2 (Solder)"

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|0.841
 
|0.841
 
|120
 
|120
|USed often
+
|Used often
 
|-
 
|-
 
|Indium antimonide
 
|Indium antimonide
Line 385: Line 385:
 
|TiO
 
|TiO
 
|4.90
 
|4.90
  +
|*1.00
|N/A
 
|
 
 
|
 
|
  +
|* z ratio not established
 
|-
 
|-
 
|Tungsten
 
|Tungsten

Revision as of 15:42, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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