Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 86: Line 86:
 
|0.775
 
|0.775
 
|
 
|
|
+
|Used often
 
|-
 
|-
 
|Carbon (graphite)
 
|Carbon (graphite)
Line 100: Line 100:
 
|0.305
 
|0.305
 
|155
 
|155
|
+
|Used often
 
|-
 
|-
 
|Cobalt
 
|Cobalt
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|0.841
 
|0.841
 
|120
 
|120
|
+
|USed often
 
|-
 
|-
 
|Indium antimonide
 
|Indium antimonide
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|0.331
 
|0.331
 
|
 
|
|
+
|Used often
 
|-
 
|-
 
|Niobium
 
|Niobium
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|0.724
 
|0.724
 
|
 
|
|
+
|USed often
 
|-
 
|-
 
|Titanium
 
|Titanium
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|0.628
 
|0.628
 
|
 
|
|
+
|Used often
 
|-
 
|-
 
|Titanium (IV) Oxide
 
|Titanium (IV) Oxide
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|0.514
 
|0.514
 
|
 
|
|
+
|Used often
 
|-
 
|-
 
|Zinc Oxide
 
|Zinc Oxide

Revision as of 11:23, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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