Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 377: Line 377:
 
|Titanium (IV) Oxide
 
|Titanium (IV) Oxide
 
|TiO<sub>2</sub>
 
|TiO<sub>2</sub>
|4.50
+
|4.26
|0.628
+
|0.40
 +
|
 +
|
 +
|-
 +
|Titanium Oxide
 +
|TiO
 +
|4.90
 +
|N/A
 +
|
 +
|
 +
|-
 +
|Tangsten
 +
|W
 +
|19.3
 +
|0.163
 +
|
 +
|
 +
|-
 +
|Tangsten carbide
 +
|WC
 +
|15.6
 +
|0.151
 +
|
 +
|
 +
|-
 +
|Zinc
 +
|Zn
 +
|7.04
 +
|0.514
 +
|
 +
|
 +
|-
 +
|Zinc Oxide
 +
|Zn
 +
|5.61
 +
|0.556
 +
|
 +
|
 +
|-
 +
|Zinc Sulfide
 +
|ZnS
 +
|4.09
 +
|0.775
 +
|
 +
|
 +
|-
 +
|Zirconium
 +
|Zr
 +
|6.51
 +
|0.60
 +
|
 +
|
 +
|-
 +
|Zirconium Oxide
 +
|ZrO<sub>2</sub>
 +
|5.6
 +
|
 
|
 
|
 
|
 
|
 
|-
 
|-

Revision as of 09:20, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table