Difference between revisions of "Thermal Evap 2 (Solder)"

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|8.2
 
|8.2
 
|0.30
 
|0.30
  +
|
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|
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|-
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|Tin
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|Sn
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|7.30
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|0.724
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|
  +
|
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|-
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|Titanium
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|Ti
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|4.50
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|0.628
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|
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|
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|-
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|Titanium (IV) Oxide
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|TiO<sub>2</sub>
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|4.50
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|0.628
 
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Revision as of 09:13, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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