Difference between revisions of "Thermal Evap 2 (Solder)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 358: Line 358:
 
|8.2
 
|8.2
 
|0.30
 
|0.30
 +
|
 +
|
 +
|-
 +
|Tin
 +
|Sn
 +
|7.30
 +
|0.724
 +
|
 +
|
 +
|-
 +
|Titanium
 +
|Ti
 +
|4.50
 +
|0.628
 +
|
 +
|
 +
|-
 +
|Titanium (IV) Oxide
 +
|TiO<sub>2</sub>
 +
|4.50
 +
|0.628
 
|
 
|
 
|
 
|
 
|-
 
|-

Revision as of 09:13, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
Sign up for this tool



About

Materials Table