Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 214: Line 214:
 
|
  
|
 
|-
  
|-
−  
−  
−  
 
|Manganese
  
|Manganese
 
|Mn
  
|Mn
 
|7.20
  
|7.20
 
|0.377
  
|0.377
  +
|
  +
|
  +
|-
  +
|Manganese(II) Sulfide
  +
|MnS
  +
|3.99
  +
|0.94
  +
|
  +
|
  +
|-
  +
|Mercury
  +
|Hg
  +
|13.46
  +
|0.74
  +
|
  +
|
  +
|-
  +
|Molybdenum
  +
|Mo
  +
|10.2
  +
|0.257
  +
|
  +
|
  +
|-
  +
|Nickel
  +
|Ni
  +
|8.91
  +
|0.331
  +
|
  +
|
  +
|-
  +
|Niobium
  +
|Nb
  +
|8.57
  +
|0.493
  +
|
  +
|
  +
|-
  +
|Niobium(V) Oxide
  +
|Nb2O5
  +
|4.47
  +
|
  +
|
  +
|
  +
|-
  +
|Palladium
  +
|Pd
  +
|12.0
  +
|0.357
  +
|
  +
|
  +
|-
  +
|Platinum
  +
|Pt
  +
|21.4
  +
|0.245
  +
|
  +
|
  +
|-
  +
|Potasium Cloride
  +
|KCl
  +
|1.98
  +
|2.05
 
|
  
|
 
|
  
|

Revision as of 08:56, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table

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