Difference between revisions of "Thermal Evap 2 (Solder)"

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|0.841
 
|0.841
 
|120
 
|120
 +
|
 +
|-
 +
|Indium antimonide
 +
|InSb
 +
|5.76
 +
|0.769
 +
|
 +
|
 +
|-
 +
|Iridium
 +
|Ir
 +
|22.4
 +
|0.129
 +
|
 +
|
 +
|-
 +
|Iron
 +
|Fe
 +
|7.86
 +
|0.349
 +
|
 
|
 
|
 
|-
 
|-

Revision as of 16:35, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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