Difference between revisions of "Thermal Evap 2 (Solder)"

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|8.71
 
|8.71
 
|0.343
 
|0.343
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|-
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|Copper
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|Cu
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|8.93
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|0.437
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 +
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|-
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|Gallium
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|Ga
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|5.93
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|0.593
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|Gallium Arsenide
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|GaAs
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|5.31
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|1.59
 
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Revision as of 16:29, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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