Difference between revisions of "Thermal Evap 2 (Solder)"

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{{tool|{{PAGENAME}}
+
{{tool2|{{PAGENAME}}
 
|picture=Thermal2.jpg
 
|picture=Thermal2.jpg
 
|type = Vacuum Deposition
 
|type = Vacuum Deposition
|super= Brian Lingg
+
|super= Michael Barreraz
 +
|super2= Don Freeborn
 
|location=Bay 3
 
|location=Bay 3
 
|description = ?
 
|description = ?
Line 10: Line 11:
 
}}
 
}}
  
= About  =
+
== About  ==
 +
 +
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.
  
= Materials Table =
+
Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
  
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible collapsed wikitable"
+
== Detailed Specifications ==
|-
+
Wafers up to 12" can be mounted.
! colspan=6 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
+
 
|- bgcolor="#D0E7FF"
+
==Documentation==
! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
+
*[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions]
! width="45" bgcolor="#D0E7FF" align="center" | '''Symbol'''
+
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Density, g/cm3'''
+
== Recipes ==
! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
+
* [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]]
! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %'''
+
** ''Visit this page for the materials table and evaporation parameters for all materials available.''
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
 
|-
 
|Aluminum
 
|Al
 
|2.70
 
|1.08
 
|
 
|
 
|-
 
|Antimony
 
|Sb
 
|2.70
 
|0.768
 
|
 
|
 
|-
 
|Arsenic
 
|As
 
|5.73
 
|0.996
 
|
 
|
 
|-
 
|Beryllium
 
|Be
 
|1.85
 
|0.543
 
|
 
|
 
|-
 
|Boron
 
|B
 
|2.54
 
|0.389
 
|
 
|
 
|-
 
|Cadmium
 
|Cd
 
|8.64
 
|0.682
 
|
 
|
 
|-
 
|Cadmium sulfide
 
|CdS
 
|4.83
 
|1.02
 
|
 
|
 
|-
 
|Cadmium telluride
 
|CdTe
 
|5.85
 
|0.980
 
|
 
|
 
|-
 
|Calcium fluoride
 
|CaF2
 
|3.18
 
|0.775
 
|
 
|
 
|-
 
|Carbon (graphite)
 
|C
 
|2.25
 
|3.26
 
|
 
|
 
|-
 
|Chromium
 
|Cr
 
|7.20
 
|0.305
 
|155
 
|
 
|-
 
|Cobalt
 
|Co
 
|8.71
 
|0.343
 
|
 
|
 
|-
 
|Copper
 
|Cu
 
|8.93
 
|0.437
 
|
 
|
 
|-
 
|Gallium
 
|Ga
 
|5.93
 
|0.593
 
|
 
|
 
|-
 
|Gallium Arsenide
 
|GaAs
 
|5.31
 
|1.59
 
|
 
|
 
|-
 
|Germanium
 
|Ge
 
|5.35
 
|0.516
 
|
 
|
 
|-
 
|Gold
 
|Au
 
|19.30
 
|0.381
 
|
 
|
 
|-
 
|Indium
 
|In
 
|7.30
 
|0.841
 
|120
 
|
 
|-
 
|Indium antimonide
 
|InSb
 
|5.76
 
|0.769
 
|
 
|
 
|-
 
|Iridium
 
|Ir
 
|22.4
 
|0.129
 
|
 
|
 
|-
 
|Iron
 
|Fe
 
|7.86
 
|0.349
 
|
 
|
 
|-
 
|Lead
 
|Pb
 
|11.3
 
|1.13
 
|
 
|
 
|-
 
|Lead sulfide
 
|PbS
 
|7.50
 
|0.566
 
|
 
|
 
|-
 
|Lithium fluoride
 
|LiF
 
|2.64
 
|0.774
 
|
 
|
 
|-
 
|Magnesium
 
|Mg
 
|1.74
 
|1.61
 
|
 
|
 
|-
 
|Magnesium oxide
 
|MgO
 
|3.58
 
|0.411
 
|
 
|
 
|-
 
|Magnesium Fluoride
 
|MgF2
 
|3.00
 
|0.427
 
|
 
|
 
|-
 
|Manganese
 
|Mn
 
|7.20
 
|0.377
 
|
 
|
 
|-
 
|Manganese(II) Sulfide
 
|MnS
 
|3.99
 
|0.94
 
|
 
|
 
|-
 
|Mercury
 
|Hg
 
|13.46
 
|0.74
 
|
 
|
 
|-
 
|Molybdenum
 
|Mo
 
|10.2
 
|0.257
 
|
 
|
 
|-
 
|Nickel
 
|Ni
 
|8.91
 
|0.331
 
|
 
|
 
|-
 
|Niobium
 
|Nb
 
|8.57
 
|0.493
 
|
 
|
 
|-
 
|Niobium(V) Oxide
 
|Nb2O5
 
|4.47
 
|
 
|
 
|
 
|-
 
|Palladium
 
|Pd
 
|12.0
 
|0.357
 
|
 
|
 
|-
 
|Platinum
 
|Pt
 
|21.4
 
|0.245
 
|
 
|
 
|-
 
|Potasium Cloride
 
|KCl
 
|1.98
 
|2.05
 
|
 
|
 
|-
 
|Selenium
 
|Se
 
|4.82
 
|0.864
 
|
 
|
 
|-
 
|Silicon
 
|Si
 
|2.32
 
|0.712
 
|
 
|
 
|-
 
|Silicon(II) Oxide
 
|SiO
 
|2.13
 
|0.87
 
|
 
|
 
|-
 
|Silicon dioxide (fused quarz)
 
|SiO2
 
|2.20
 
|1.07
 
|
 
|
 
|-
 

Latest revision as of 09:29, 30 August 2022

Thermal Evap 2 (Solder)
Thermal2.jpg
Location Bay 3
Tool Type Vacuum Deposition
Manufacturer Custom
Description ?

Primary Supervisor Michael Barreraz
(805) 893-4147
mikebarreraz@ece.ucsb.edu

Secondary Supervisor

Don Freeborn


Recipes Vacuum Deposition RecipesN/A

SignupMonkey: Sign up for this tool


About

Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.

Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.

Detailed Specifications

Wafers up to 12" can be mounted.

Documentation

Recipes