Difference between revisions of "Thermal Evap 2 (Solder)"
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+ | {{tool2|{{PAGENAME}} |
|picture=Thermal2.jpg |
|picture=Thermal2.jpg |
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|type = Vacuum Deposition |
|type = Vacuum Deposition |
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| − | |super= |
+ | |super= Michael Barreraz |
| + | |super2= Don Freeborn |
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|location=Bay 3 |
|location=Bay 3 |
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|description = ? |
|description = ? |
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}} |
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| − | = About = |
+ | == About == |
| + | |||
| + | Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used. |
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| + | Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators. |
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| − | *Standard 18" bell jar pumped by 8" Varian cryopump (HV8) driven by Ebara 2.1 compressor |
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| − | *Low E-7 Torr ultimate pressure |
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| − | *Rate Monitor: Maxtek TM-300 |
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| − | *Typical material rates: Al - 1 A/s @ 85 amps |
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| − | **Au - 5 A/s @ 122 amps |
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| − | **Cr - 2 A/s @ 85 amps |
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| − | **Zn - 4.5 A/s @ 50 amps |
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| ⚫ | |||
| − | = Materials Table = |
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| + | Wafers up to 12" can be mounted. |
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| + | ==Documentation== |
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| − | {| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible collapsed wikitable" |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions] |
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| − | ! colspan=8 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div> |
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| + | == Recipes == |
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| − | |- bgcolor="#D0E7FF" |
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| + | * [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]] |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Material''' |
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| + | ** ''Visit this page for the materials table and evaporation parameters for all materials available.'' |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Symbol''' |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Density, g/cm3''' |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio''' |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %''' |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Current, Amp''' |
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| − | ! width="45" bgcolor="#D0E7FF" align="center" | '''Dep.rate, A/sec''' |
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| − | ! width="100" bgcolor="#D0E7FF" align="center" | '''Comments''' |
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| − | |- |
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Latest revision as of 10:29, 30 August 2022
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About
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.
Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
Detailed Specifications
Wafers up to 12" can be mounted.
Documentation
Recipes
- Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2
- Visit this page for the materials table and evaporation parameters for all materials available.