Difference between revisions of "Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)"

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{| class="wikitable"
 
| colspan="5" |ICP#2: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec
 
| colspan="5" |ICP#2: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec
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|
 
|-
 
|-
 
|Date
 
|Date
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|Etch Selectivity (SiO2/PR)
 
|Etch Selectivity (SiO2/PR)
 
|Averaged Sidewall Angle (<sup>o</sup>)
 
|Averaged Sidewall Angle (<sup>o</sup>)
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|SEM Images
 
|-
 
|-
 
|10/5/2018
 
|10/5/2018
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|0.74
 
|0.74
 
|77.9
 
|77.9
 
|[https://wiki.nanotech.ucsb.edu/wiki/images/f/f1/SiO2_Etch_using_ICP2_with_O2.pdf]
 
|-
 
|-
|1/28/19
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|1/28/2019
 
|I21902
 
|I21902
 
|92.1
 
|92.1
 
|0.77
 
|0.77
 
|
 
|
  +
|[https://wiki.nanotech.ucsb.edu/wiki/images/f/fa/SiO2_Etch_using_ICP2_with_O2-a.pdf]
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|-
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|3/6/2019
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|I21903
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|88.5
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|0.80
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|79.4
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|[https://wiki.nanotech.ucsb.edu/wiki/images/d/dc/SiO2_Etch_using_ICP2_with_O2-3-06-2019.pdf]
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|-
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|7/12/2019
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|I21906
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|91.9
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|0.69
  +
|78.1
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|[https://wiki.nanotech.ucsb.edu/wiki/images/0/04/I2190605.pdf]
 
|}
 
|}
https://www.nanotech.ucsb.edu/wiki/images/f/f1/SiO2_Etch_using_ICP2_with_O2.pdf
 

Latest revision as of 18:26, 6 April 2020

ICP#2: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images
10/5/2018 SiO2#01 95.2 0.74 77.9 [1]
1/28/2019 I21902 92.1 0.77 [2]
3/6/2019 I21903 88.5 0.80 79.4 [3]
7/12/2019 I21906 91.9 0.69 78.1 [4]