Difference between revisions of "Test Data of etching SiO2 with CHF3/CF4-ICP1"

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|'''Etch Rate (nm/min)'''
  
|'''Etch Rate (nm/min)'''
 
|'''Etch Selectivity (SiO2/PR)'''
  
|'''Etch Selectivity (SiO2/PR)'''
  +
|'''Comments'''
−
|'''Averaged Sidewall Angle (<sup>o</sup>)'''
  
 
|'''SEM Images'''
  
|'''SEM Images'''
  +
|-
  +
|11/18/2022
  +
|ND_Pan1_111822
  +
|132.6
  +
|1.25
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/1/14/30D_pan1_111822_002.jpg <nowiki>[30D]</nowiki>][https://wiki.nanotech.ucsb.edu/w/images/3/35/CS_pan1_111822_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|11/07/2022
  +
|ND_Pan1_110722
  +
|125.7
  +
|1.35
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/5/54/30D_pan1_110722_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/8/81/CS_pan1_110722_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|10/21/2022
  +
|ND_Pan1_102122
  +
|114.3
  +
|1.15
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/0/03/30D_pan1_102122_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/2/29/CS_pan1_102122_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|10/10/2022
  +
|ND_Pan1_101022
  +
|127.4
  +
|1.25
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/4/40/30D_pan1_101022_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/1/17/CS_pan1_101022_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|10/3/2022
  +
|ND_Pan1_100322
  +
|132.9
  +
|1.19
  +
|High etch rate and selectivity.
  +
  +
May be due to angled ridge.
  +
|[https://wiki.nanotech.ucsb.edu/w/images/1/1f/30D_10302022_pan1_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/f/f1/CS_10302022_pan1_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|9/26/2022
  +
|ND_Pan1n_092622
  +
|111.1
  +
|0.90
  +
|This is the new wafer
  +
|[https://wiki.nanotech.ucsb.edu/w/images/6/68/30D_Pan1n_092622_002.jpg <nowiki>[30D]</nowiki>] [[https://wiki.nanotech.ucsb.edu/w/images/c/c7/CS_Pan1n_092622_002.jpg <nowiki>CS]</nowiki>]
  +
|-
  +
|9/26/2022
  +
|ND_Pan1o_092622
  +
|114.3
  +
|1.01
  +
|This is the old wafer
  +
|[https://wiki.nanotech.ucsb.edu/w/images/0/07/45D_Pan1o_092622_002.jpg <nowiki>[45D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/b/b7/CS_Pan1o_092622_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|9/12/2022
  +
|ND_Pan1_091222
  +
|128.6
  +
|1.33
  +
|New Si wafer, higher etch rate/
  +
selectivity
  +
|[https://wiki.nanotech.ucsb.edu/w/images/8/8b/30D_pan1_091222_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/5/57/CS_pan1_091222_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|9/01/2022
  +
|ND_Pan1_090122
  +
|120.9
  +
|1.05
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/0/06/30D_pan1_090122_001.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/1/1c/CS_pan1_090122_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|8/22/2022
  +
|ND_Pan1_082222
  +
|112.9
  +
|1.08
  +
|Etch Rate seems low
  +
and selectivity on the lower side
  +
|[https://wiki.nanotech.ucsb.edu/w/images/4/4e/45D_Pan1_082222_001.jpg <nowiki>[45D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/b/b9/CS_Pan1_082222_002.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|8/5/2022
  +
|ND_Pan 1_080522
  +
|115.1
  +
|0.90
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/b/b2/30D_08052022_pan1_001.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/1/12/CS_08052022_pan1_001.jpg <nowiki>[CS]</nowiki>]
  +
|-
  +
|7/27/2022
  +
|ND_Pan1_072722
  +
|134.6
  +
|1.12
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/3/35/CS_004.jpg <nowiki>[CS]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/7/79/30D_001.jpg <nowiki>[30D]</nowiki>]
  +
|-
  +
|5/10/2022
  +
|NP_ICP1_07
  +
|136
  +
|1.34
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/a/a4/ICP1_07_45D_008.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/a/a7/ICP1_07_CS_006.jpg <nowiki>[2]</nowiki>]
  +
|-
  +
|4/26/2022
  +
|NP_ICP1_06
  +
|139.4
  +
|1.36
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/5/56/ICP1_06_45D_002.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/4/49/ICP1_06_CS_002.jpg <nowiki>[2]</nowiki>]
  +
|-
  +
|4/20/2022
  +
|NP_ICP1_05
  +
|140
  +
|1.13
  +
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/7/74/ICP1_05_45D_001.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/7/72/ICP1_05_CS_002.jpg <nowiki>[2]</nowiki>]
 
|-
  
|-
 
|4/13/2022
  
|4/13/2022
 
|NP_ICP1_04
  
|NP_ICP1_04
 
|140.3
  
|140.3
  +
|1.24
−
|
  
 
|
  
|
 
|[https://wiki.nanotech.ucsb.edu/w/images/9/98/ICP1_004_45D_004.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/4/45/ICP1_004_CS_001.jpg <nowiki>[2]</nowiki>]
  
|[https://wiki.nanotech.ucsb.edu/w/images/9/98/ICP1_004_45D_004.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/4/45/ICP1_004_CS_001.jpg <nowiki>[2]</nowiki>]

Revision as of 18:23, 21 November 2022

ICP#1 Recipe: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Comments SEM Images
11/18/2022 ND_Pan1_111822 132.6 1.25 [30D][CS]
11/07/2022 ND_Pan1_110722 125.7 1.35 [30D] [CS]
10/21/2022 ND_Pan1_102122 114.3 1.15 [30D] [CS]
10/10/2022 ND_Pan1_101022 127.4 1.25 [30D] [CS]
10/3/2022 ND_Pan1_100322 132.9 1.19 High etch rate and selectivity.

May be due to angled ridge.

[30D] [CS]
9/26/2022 ND_Pan1n_092622 111.1 0.90 This is the new wafer [30D] [CS]
9/26/2022 ND_Pan1o_092622 114.3 1.01 This is the old wafer [45D] [CS]
9/12/2022 ND_Pan1_091222 128.6 1.33 New Si wafer, higher etch rate/

selectivity

[30D] [CS]
9/01/2022 ND_Pan1_090122 120.9 1.05 [30D] [CS]
8/22/2022 ND_Pan1_082222 112.9 1.08 Etch Rate seems low

and selectivity on the lower side

[45D] [CS]
8/5/2022 ND_Pan 1_080522 115.1 0.90 [30D] [CS]
7/27/2022 ND_Pan1_072722 134.6 1.12 [CS] [30D]
5/10/2022 NP_ICP1_07 136 1.34 [1] [2]
4/26/2022 NP_ICP1_06 139.4 1.36 [1] [2]
4/20/2022 NP_ICP1_05 140 1.13 [1] [2]
4/13/2022 NP_ICP1_04 140.3 1.24 [1] [2]
3/29/2022 NP_ICP1_03 136.9 1.19 [1][2]
3/8/2022 NP_ICP1_02 133.7 1.12 [1] [2]
3/2/2022 NP_ICP1_01 141.4 1.20 [1] [2]
1/7/2021 I12101 118 1.12 [1]
3/3/2020 I12004 110 1.05 [2]
Sidewall profile on 2/28/2020 etches is slanted, chamber will be wet-cleaned on 3/2/2020 and re-tested. Data for 3/3 shows etch returned to "normal".
2/28/2020 I12003 119 1.17 56.6 [3]
1/23/2020 I12002 109 1.16 [4]
Rate on 1/13/2020 is low by ~20%, so chamber was wet-cleaned on 1/21/2020. Data below for 1/23 shows rate returned to "normal".
1/13/2020 I12001 78.0 1.06 unusual - two regions [5]
5/29/2019 I11903 105 1.41 [6]
1/28/2019 I11901 110 1.35 see SEM → [7]


OLD Etch Test Data

Alternate SiO2 etch recipe with O2 included.

ICP#1: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images
1/28/2019 I11902 78.1 0.63 [8]
5/29/2019 I11904 71.1 0.58 [9]
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