Difference between revisions of "Test Data of etching SiO2 with CHF3/CF4-ICP1"

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Revision as of 15:37, 23 January 2020

ICP#1: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images
1/28/2019 I11901 110 1.35 [1]
5/29/2019 I11903 105 1.41 [2]
1/13/2020 I12001 78.0 1.06 [3]
1/23/2020 I12002 109 1.16 [4]
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