Difference between revisions of "Test Data of etching SiO2 with CHF3/CF4"

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{| class="wikitable"
 
{| class="wikitable"
| colspan="5" |ICP#1: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
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| colspan="5" |ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
 
|-
 
|-
 
|Date
 
|Date
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|Etch Selectivity (SiO2/PR)
 
|Etch Selectivity (SiO2/PR)
 
|Averaged Sidewall Angle (<sup>o</sup>)
 
|Averaged Sidewall Angle (<sup>o</sup>)
  +
|-
  +
|10-8-2018
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|SiO2#02
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|160
  +
|1.23
  +
|82.1
 
|-
 
|-
 
|1/28/2019
 
|1/28/2019
  +
|I21901
|I11901
 
|110
+
|146
|1.35
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|1.23
 
|
 
|
 
|}
 
|}

Revision as of 11:26, 29 January 2019

ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o)
10-8-2018 SiO2#02 160 1.23 82.1
1/28/2019 I21901 146 1.23

File:SiO2 Etch using ICP2-no O2-a.pdf