Difference between revisions of "Test Data of etching SiO2 with CHF3/CF4"

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|Etch Selectivity (SiO2/PR)
 
|Etch Selectivity (SiO2/PR)
 
|Averaged Sidewall Angle (<sup>o</sup>)
 
|Averaged Sidewall Angle (<sup>o</sup>)
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|10/5/2018
 
|SiO2#02
 
|160
 
|1.2
 
|82.1
 
 
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|1/28/2019
 
|1/28/2019
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|I11901
|I21901
 
|146
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|1.2
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Revision as of 11:13, 29 January 2019

ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o)
1/28/2019 I11901

File:SiO2 Etch using ICP2-no O2-a.pdf