Difference between revisions of "Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(Created page with "{| class="wikitable" | colspan="6" |Florine ICP: 3.8mT, 50/800W, CHF3/CF4=10/30sccm, time=90 sec |- |Date |Sample# |Etch Rate (nm/min) |Etch Selectivity (SiO2/PR) |Averaged...")
 
 
(One intermediate revision by the same user not shown)
Line 1: Line 1:
 
{| class="wikitable"
 
{| class="wikitable"
| colspan="6" |Florine ICP: 3.8mT, 50/800W, CHF3/CF4=10/30sccm, time=90 sec
+
| colspan="6" |Florine ICP: 3.8mT, 50/800W, CHF3/CF4=10/30sccm, and Time=90 sec
 
|-
 
|-
 
|Date
 
|Date
Line 14: Line 14:
 
|0.99
 
|0.99
 
|
 
|
  +
|[https://wiki.nanotech.ucsb.edu/w/images/0/0b/FE210206.pdf]
|
 
 
|}
 
|}

Latest revision as of 18:30, 2 February 2021

Florine ICP: 3.8mT, 50/800W, CHF3/CF4=10/30sccm, and Time=90 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images
1/28/2021 FE2102 309 0.99 [1]