Difference between revisions of "Template:News"
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We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers. Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for [[Stepper 3 (ASML DUV)|ASML DUV Stepper]] wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well. |
We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers. Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for [[Stepper 3 (ASML DUV)|ASML DUV Stepper]] wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well. |
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// [[User:John d|John d]] 12:10, 20 February 2019 (PST) |
// [[User:John d|John d]] 12:10, 20 February 2019 (PST) |
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| − | === Filmetrics Optical Profilometer === |
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| − | A new [https://www.filmetrics.com/profilometers/profilm3d Filmetrics Profilm3D] optical profilometer is being qualified. The system complements the [[Laser_Scanning_Confocal_M-scope_(Olympus_LEXT)|LEXT Confocal Microscope]] and [[Atomic Force Microscope (Bruker ICON)|AFM]], by providing large-area profiles (~5-10mm square) with nanometer-level height resolution, and possibly a fast surface roughness measurement. See the [[White-Light/Phase-Shift_Interference_Profilometer_(Filmetrics_Profilm3D)|Profilm3D Wiki Page]] for more info on the capabilities and techniques. |
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| − | // [[User:John d|John d]] 10:59, 14 December 2018 (PST) |
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=== Filmetrics Optical Measurement Systems === |
=== Filmetrics Optical Measurement Systems === |
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Revision as of 19:02, 25 February 2020
News from the U.C. Santa Barbara Nanofabrication Facility.
TechTalk: Dr. Renan Moreira & Grégoire Coiffard
Tech Talks on Thurs Dec 5th, in ESB room 1001 (click for more info):
12n: Dr. Renan Moreira, ULL Technologies: “Ultra-low loss photonic integrated circuits based on Si3N4 waveguides”
1245pm: Grégoire Coiffard, Mazin Group, Physics Dept. UCSB, “The fabrication of 20,000 pixel kinetic inductance detector arrays for near-IR to visible astronomy”
New Plasma Asher Installation
A new YES EcoClean Plasma Strip/Descum System is being installed, for controlled photoresist etching & residue stripping. We will make an announcement when the system has been qualified and is ready for use. // John d 11:03, 7 August 2019 (PDT)
Rapid Thermal Annealer Installed
We are installing and qualifying a new SSI Solaris 150 Rapid Thermal Processor. We will make an announcement when the system is ready and trainings are scheduled. See the SSI RTP Wiki Page here. // John d 12:03, 28 May 2019 (PDT)
S-Cubed Spin/Coat/Dev Station Installation
We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers. Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for ASML DUV Stepper wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well. // John d 12:10, 20 February 2019 (PST)
Filmetrics Optical Measurement Systems
A Filmetrics F10-RT for optical reflection/transmission spectra, and a Filmetrics F50 thin-film wafer-mapping system have been installed. Contact Ning Cao for more info. // John d 15:24, 12 December 2018 (PST)
KLA Tencor Profilometer Installed
We have purchased a new KLA Tencor Stylus Profilometer, that has been installed in Bay 4. // John d 17:28, 12 September 2018 (PDT)
Laser Endpoint Monitors
We've installed new Intellemetrics LEP500 Laser Endpoint Detection monitoring on the DSEiii & ICP#2 & ICP#1 etchers. This allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes. // John d 09:26, 17 July 2018 (PDT)
Metal Processes on the Atomic Layer Deposition
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the Oxford FlexAL ALD tool. See the Atomic Layer Deposition: Recipes page or contact Bill Mitchell for more information. // Posted: 16:07, 01 June 2017 (PST)
New Deep Silicon Etcher Online
A new Plasma-Therm Versaline DSE III DRIE etcher has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system. // Posted: 22:16, 27 November 2017 (PST)
2016 Survey Results
See the May 2016 User Survey Results. // Posted: 12:00, 01 May 2016 (PST)
CAIBE Ion Mill Available
The CAIBE (Oxford Ion Mill) is up and running! Contact Brian Lingg for more information. // Posted: 12:00, 01 July 2015 (PST)
NanoFiles SFTP Online
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check SignupMonkey for details. // Posted: 12:00, 07 July 2013 (PST)