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=== NanoFab staff awarded Goleta's Innovator of the Year 2023 ===
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NanoFab staff member [[Demis D. John]] has been awarded the ''City of Goleta's "Innovator of the Year"'' for 2023! The award stems from the UCSB Nanofab's impact on the communities of Santa Barbara County and surrounding regions, in enabling cutting edge technology companies to thrive, which also enables many local careers in advanced high-tech. See the [https://sbscchamber.com/goletas-finest-2023-award-recipients-announced/ full announcement by the Santa Barbara South Coast Chamber of Commerce]. //[[User:John d|John d]] 13:58, 7 November 2023 (PST)
   
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=== NanoFab Featured in Regional Tech Videos ===
=== Digital Microscope: Olympus DX-1000 ===
 
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The UCSB NanoFab is showcased as a driver of innovation and enabler of the regional high-tech industry.
You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DX-1000]. We are currently developing procedures, keep an eye out for training emails.
 
// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
 
   
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See the videos here:
=== Raith Velion: FIB/SEM Installation ===
 
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{| class="wikitable"
We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
 
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|[https://fast.wistia.net/embed/iframe/l46hsnwg4b?controlsVisibleOnLoad=true&muted=0&playerColor&copyLinkAndThumbnailEnabled=false '''''Santa Barbara County: This is TechTopia'''''] [[File:Techtopia_Vid_-_Thumbnail_PlayButton.jpg|none|300x300px|link=https://fast.wistia.net/embed/iframe/l46hsnwg4b?controlsVisibleOnLoad=true&muted=0&playerColor&copyLinkAndThumbnailEnabled=false]]
The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
 
   
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|[https://www.youtube.com/watch?v=op746os6eRI '''''UCSB NanoFab: An Innovation Center'''''] [[File:NanoFab_COE_Engineering_Vid_-_thumbnail_2_crop.jpg|none|300x300px|link=https://www.youtube.com/watch?v=op746os6eRI]]
Learn more about the tool's capabilities at the Raith website:
 
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|}
* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
 
* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
 
   
 
// [[User:John d|John d]] 09:26, 1 November 2023 (PST)
Tool qualification is currently underway.
 
[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
 
   
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=== CHIPS Act Award Announced to USC and UCSB NanoFab ===
// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
 
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[https://carbajal.house.gov/news/documentsingle.aspx?DocumentID=1672 U.S. Congressman Salud Carbajal congratulates UCSB and the NanoFab] on receiving a [https://www.nist.gov/chips CHIPS & Science Act] award, as part of the [https://microelectronicscommons.org/ California DREAMS Hub (Microelectronics Commons) led by USC].
 
// [[User:John d|Demis]] 12:06, 4 October 2023 (PDT)
   
 
=== JEOL SEM's Installed ===
=== Heidelberg MLA-150: Delivery Scheduled for Sept. ===
 
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Both SEM's have been replaced with new JEOL [[SEM_1_(JEOL_IT800SHL)|SEM's #1]] and [[Field_Emission_SEM_2_(JEOL_IT800SHL)|SEM #2]]. SEM#1 has the NABITY lithography system installed, and SEM #2 has always-on EDAX elemental analysis. Contact the [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information.
Our Heidelberg Maskless Aligner (MLA150) will be installed the week of September 21st 2020! This tool enables flexible I-Line lithography, in which a user can align to arbitrary features (eg. 2D materials, quantum dots), upload a CAD file to write a pattern without ordering a mask plate, grey-scale lithography and continuous auto-focus on non-planar substrates.
 
 
// [[User:John d|John d]] 18:31, 20 September 2023 (PDT)
   
 
=== Wide FOV Microscope Installed ===
Learn more about the tool at the Heidelberg Instruments website:
 
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We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available. Wiki page here: [[Microscopes#Microscope_.238:_AmScope_Wide_Field_of_View_Stereoscope_.28Bay_4.29|AmScope Wide Field of View Stereoscope]]
* [https://heidelberg-instruments.com/en/features-technologies/key-features/maskless-lithography.html Maskless Lithography: Direct Writing Basics]
 
 
// [[User:John d|John d]] 14:52, 19 April 2023 (PDT)
* [https://heidelberg-instruments.com/en/products/mla150.html Heidelberg MLA150]
 
   
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=== Loomis Scribe & Break installed ===
// [[User:John d|John d]] 11:41, 14 September 2020 (PDT)
 
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We have installed a new [https://loomisinc.com/lsd-155lt/ Loomis LSD-155LT] Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information.
 
// [[User:John d|John d]] 09:41, 16 April 2023 (PDT)
   
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=== Dektak XT installed ===
=== TechTalk: Dr. Renan Moreira & Grégoire Coiffard ===
 
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We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection.
[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Tech_Talks_Seminar_Series#Thursday.2C_Dec._5.2C_12pm.2C_ESB1001.2C_Light_Lunch_Provided Tech Talks on Thurs Dec 5th, in ESB room 1001 (click for more info)]:
 
 
// [[User:John d|John d]] 10:41, 25 January 2023 (PST)
   
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=== New Process Control data tables ===
12n: Dr. Renan Moreira, ULL Technologies: “Ultra-low loss photonic integrated circuits based on Si3N4 waveguides”
 
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We have added [[Process_Group_-_Process_Control_Data|"Process Control Data"]] - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for [[Vacuum_Deposition_Recipes|'''Deposition Recipes''']] or [[Dry_Etching_Recipes|'''Etch Recipes''']].
 
 
// [[User:John d|John d]] 16:07, 5 January 2023 (PST)
1245pm: Grégoire Coiffard, Mazin Group, Physics Dept. UCSB, “The fabrication of 20,000 pixel kinetic inductance detector arrays for near-IR to visible astronomy”
 
// [[User:John d|John d]] 11:03, 5 December 2019 (PDT)
 
 
=== New Plasma Asher Installation ===
 
A new [https://www.yieldengineering.com/Products/Plasma-Strip-Descum-Systems/YES-ÉcoClean ''YES EcoClean Plasma Strip/Descum System''] is being installed, for controlled photoresist etching & residue stripping. We will make an announcement when the system has been qualified and is ready for use.
 
// [[User:John d|John d]] 11:03, 7 August 2019 (PDT)
 
 
=== Rapid Thermal Annealer Installed ===
 
We are installing and qualifying a new [http://ssi-rtp.com/page/products/rtp-solaris-150/ SSI ''Solaris 150 Rapid Thermal Processor'']. We will make an announcement when the system is ready and trainings are scheduled. See the [[Rapid Thermal Processor (SSI Solaris 150)|SSI RTP Wiki Page here]].
 
// [[User:John d|John d]] 12:03, 28 May 2019 (PDT)
 
 
=== S-Cubed Spin/Coat/Dev Station Installation ===
 
We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers. Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for [[Stepper 3 (ASML DUV)|ASML DUV Stepper]] wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well.
 
// [[User:John d|John d]] 12:10, 20 February 2019 (PST)
 
 
=== Filmetrics Optical Measurement Systems ===
 
A [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Filmetrics F10-RT]] for optical reflection/transmission spectra, and a [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Filmetrics F50]] thin-film wafer-mapping system have been installed. Contact [[Ning Cao|Ning Cao]] for more info.
 
// [[User:John d|John d]] 15:24, 12 December 2018 (PST)
 
 
=== KLA Tencor Profilometer Installed ===
 
We have installed a new [[Step Profilometer (KLA Tencor P-7)|KLA Tencor Stylus Profilometer]], that has been installed in Bay 4. Contact [[Brian Lingg|Brian Lingg]] for training.
 
// [[User:John d|John d]] 17:28, 12 September 2018 (PDT)
 
 
=== Laser Endpoint Monitors ===
 
We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] & [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]] etchers. This allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes.
 
// [[User:John d|John d]] 09:26, 17 July 2018 (PDT)
 
 
=== Metal Processes on the Atomic Layer Deposition ===
 
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool. See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
 
// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
 
 
=== New Deep Silicon Etcher Online ===
 
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
 
// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
 
 
=== 2016 Survey Results ===
 
See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.
 
// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
 
 
=== CAIBE Ion Mill Available ===
 
The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.
 
// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
 
 
=== NanoFiles SFTP Online ===
 
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.
 
// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
 
   
 
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Latest revision as of 22:06, 16 November 2023

News from the U.C. Santa Barbara Nanofabrication Facility.

NanoFab staff awarded Goleta's Innovator of the Year 2023

NanoFab staff member Demis D. John has been awarded the City of Goleta's "Innovator of the Year" for 2023! The award stems from the UCSB Nanofab's impact on the communities of Santa Barbara County and surrounding regions, in enabling cutting edge technology companies to thrive, which also enables many local careers in advanced high-tech. See the full announcement by the Santa Barbara South Coast Chamber of Commerce. //John d 13:58, 7 November 2023 (PST)

NanoFab Featured in Regional Tech Videos

The UCSB NanoFab is showcased as a driver of innovation and enabler of the regional high-tech industry.

See the videos here:

Santa Barbara County: This is TechTopia
Techtopia Vid - Thumbnail PlayButton.jpg
UCSB NanoFab: An Innovation Center
NanoFab COE Engineering Vid - thumbnail 2 crop.jpg

// John d 09:26, 1 November 2023 (PST)

CHIPS Act Award Announced to USC and UCSB NanoFab

U.S. Congressman Salud Carbajal congratulates UCSB and the NanoFab on receiving a CHIPS & Science Act award, as part of the California DREAMS Hub (Microelectronics Commons) led by USC. // Demis 12:06, 4 October 2023 (PDT)

JEOL SEM's Installed

Both SEM's have been replaced with new JEOL SEM's #1 and SEM #2. SEM#1 has the NABITY lithography system installed, and SEM #2 has always-on EDAX elemental analysis. Contact the supervisor, Aidan Hopkins, for more information. // John d 18:31, 20 September 2023 (PDT)

Wide FOV Microscope Installed

We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available. Wiki page here: AmScope Wide Field of View Stereoscope // John d 14:52, 19 April 2023 (PDT)

Loomis Scribe & Break installed

We have installed a new Loomis LSD-155LT Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact supervisor, Aidan Hopkins, for more information. // John d 09:41, 16 April 2023 (PDT)

Dektak XT installed

We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection. // John d 10:41, 25 January 2023 (PST)

New Process Control data tables

We have added "Process Control Data" - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for Deposition Recipes or Etch Recipes. // John d 16:07, 5 January 2023 (PST)

See older articles at this link