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=== New Rapid Thermal Annealer Installation ===
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=== SiO2 etching, High-Aspect Ratio ===
We are installing and qualifying a new [http://ssi-rtp.com/page/products/rtp-solaris-150/ SSI ''Solaris 150 Rapid Thermal Processor''].  We will make an announcement when the system is ready and trainings are scheduled.
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. 
// [[User:John d|John d]] 12:03, 28 May 2019 (PDT)
 
  
=== S-Cubed Spin/Coat/Dev Station Installation ===
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers.  Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for [[Stepper 3 (ASML DUV)|ASML DUV Stepper]] wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well.
 
// [[User:John d|John d]] 12:10, 20 February 2019 (PST)
 
  
=== Filmetrics Optical Profilometer ===
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
A new [https://www.filmetrics.com/profilometers/profilm3d Filmetrics Profilm3D] optical profilometer is being qualified. The system complements the [[Laser_Scanning_Confocal_M-scope_(Olympus_LEXT)|LEXT Confocal Microscope]] and [[Atomic Force Microscope (Bruker ICON)|AFM]], by providing large-area profiles (~5-10mm square) with nanometer-level height resolution, and possibly a fast surface roughness measurement.  See the [[White-Light/Phase-Shift_Interference_Profilometer_(Filmetrics_Profilm3D)|Profilm3D Wiki Page]] for more info on the capabilities and techniques.
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
// [[User:John d|John d]] 10:59, 14 December 2018 (PST)
 
  
=== Filmetrics Optical Measurement Systems ===
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=== Wafer Polisher available ===
A [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Filmetrics F10-RT]] for optical reflection/transmission spectra, and a [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Filmetrics F50]] thin-film wafer-mapping system have been installed.  Contact Ning Cao for more info.
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information. // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
// [[User:John d|John d]] 15:24, 12 December 2018 (PST)
 
  
=== KLA Tencor Profilometer Installed ===
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=== Digital Microscope: Olympus DSX-1000 ===
We have purchased a new [[Step Profilometer (KLA Tencor P-7)|KLA Tencor Stylus Profilometer]], that has been installed in Bay 4.
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
// [[User:John d|John d]] 17:28, 12 September 2018 (PDT)
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
  
=== Laser Endpoint Monitors ===
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=== Raith Velion: FIB/SEM Installation ===
We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] & [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]] etchers. This allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes.
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
// [[User:John d|John d]] 09:26, 17 July 2018 (PDT)
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
  
=== Metal Processes on the Atomic Layer Deposition ===
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Learn more about the tool's capabilities at the Raith website:
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] toolSee the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].   
// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
  
=== New Deep Silicon Etcher Online ===
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Tool qualification is currently underway.
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
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[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
 
  
=== 2016 Survey Results ===
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// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
See the May 2016 {{file|Survey052016.pdf| User Survey Results}}. 
 
// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
 
 
 
=== CAIBE Ion Mill Available ===
 
The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.
 
// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
 
 
 
=== NanoFiles SFTP Online ===
 
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.
 
// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
 
 
 
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Latest revision as of 14:59, 31 August 2021

News from the U.C. Santa Barbara Nanofabrication Facility.

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)