Difference between revisions of "Template:News"

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=== S-Cubed Spin/Coat/Dev Station Installation ===
 
We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers.  Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for ASML DUV Stepper wafer prep. As procedures are developed, the system will eventually be opened for I-Line stepper use as well.
 
// [[User:John d|John d]] 12:10, 20 February 2019 (PST)
 
  
=== Filmetrics Optical Profilometer ===
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=== SiO2 etching, High-Aspect Ratio ===
A new [https://www.filmetrics.com/profilometers/profilm3d Filmetrics Profilm3D] optical profilometer is being qualified. The system complements the [[Laser_Scanning_Confocal_M-scope_(Olympus_LEXT)|LEXT Confocal Microscope]] and [[Atomic Force Microscope (Bruker ICON)|AFM]], by providing large-area profiles (~5-10mm square) with nanometer-level height resolution, and possibly a fast surface roughness measurement.  See the [[White-Light/Phase-Shift_Interference_Profilometer_(Filmetrics_Profilm3D)|Profilm3D Wiki Page]] for more info on the capabilities and techniques.
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. 
// [[User:John d|John d]] 10:59, 14 December 2018 (PST)
 
  
=== Filmetrics Optical Measurement Systems ===
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
A [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Filmetrics F10-RT]] for optical reflection/transmission spectra, and a [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Filmetrics F50]] thin-film wafer-mapping system have been installed. Contact Ning Cao for more info.
 
// [[User:John d|John d]] 15:24, 12 December 2018 (PST)
 
  
=== KLA Tencor Profilometer Installed ===
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
We have purchased a new [[Step Profilometer (KLA Tencor P-7)|KLA Tencor Stylus Profilometer]], that has been installed in Bay 4.
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
// [[User:John d|John d]] 17:28, 12 September 2018 (PDT)
 
  
=== Laser Endpoint Monitors ===
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=== Wafer Polisher available ===
We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] & [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]] etchersThis allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes.
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
// [[User:John d|John d]] 09:26, 17 July 2018 (PDT)
 
  
=== Metal Processes on the Atomic Layer Deposition ===
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=== Digital Microscope: Olympus DSX-1000 ===
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool. See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
  
=== New Deep Silicon Etcher Online ===
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=== Raith Velion: FIB/SEM Installation ===
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
  
=== 2016 Survey Results ===
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Learn more about the tool's capabilities at the Raith website:
See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.   
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].   
// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
  
=== CAIBE Ion Mill Available ===
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Tool qualification is currently underway.
The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.  
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[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
 
  
=== NanoFiles SFTP Online ===
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// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.
 
// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
 
 
 
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Latest revision as of 14:59, 31 August 2021

News from the U.C. Santa Barbara Nanofabrication Facility.

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)