Difference between revisions of "Template:News"

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* Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details. ''(7/7/2013)''
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* The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information. ''(7/2015)''
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<!---feedBurner name="UCSBNanofab-NewsFeed" /-->
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''News from the U.C. Santa Barbara Nanofabrication Facility.''
<noinclude>[[Category:Templates]]</noinclude>
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<!-- these comments only show up when viewing the page source, but not when the page is viewed normally (eg. the RSS feed) -->
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'''How to add news items'''
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* New news item should be inserted at the TOP of the list
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* Item titles should have a level 3 heading, like so:  === MyArticleTitle ===
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* Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line.  When you 'Save' the page, this will be replaced with a timestamp and your user name. 
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* Then delete your username, leaving only the two dashes, so "[[User:Thibeault|-- Brain Thibeault]]" becomes "[[User:Thibeault|-- ]]"
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* Also delete the "[[... (talk)]]" link
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* The timestamp determines the order of items in the feed. Items without a timestamp will show up at the end of the feed in random order.
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<!-------- NEWS ITEMS: newest on top -------->
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=== Oxford PlasmaPro ICP Etcher installed ===
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We have a new ICP etcher in Bay 2:
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[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
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The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
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In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
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// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
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=== SiO2 etching, High-Aspect Ratio ===
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. 
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
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=== Wafer Polisher available ===
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information. // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
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=== Digital Microscope: Olympus DSX-1000 ===
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
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=== Raith Velion: FIB/SEM Installation ===
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
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Learn more about the tool's capabilities at the Raith website:
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion]. 
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
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Tool qualification is currently underway.
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[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
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// [[User:John d|John d]] 06:53, 30 November 2020 (PST)

Latest revision as of 20:30, 29 September 2021

News from the U.C. Santa Barbara Nanofabrication Facility.

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)