Difference between revisions of "Template:News"
(Created page with "* A new Stepper (ASML) has been purchased and is up and running! Contact Adam Abrahamsen for more information. ''(12/1/2011)'' * Effective immediately we will no longer b…") |
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− | * A new Stepper ([[ASML]]) has been purchased and is up and running! Contact [[Adam Abrahamsen]] for more information. ''(12/1/2011)'' |
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+ | <!---feedBurner name="UCSBNanofab-NewsFeed" /--> |
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− | * Effective immediately we will no longer be returning confiscated glassware. ''(3/1/2012)'' |
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+ | <!-- Description of the RSS feed --> |
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− | * Garment changeout will occur next Friday (3/16), please remember to remove items from your pockets. ''(3/5/2012)'' |
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+ | ''News from the U.C. Santa Barbara Nanofabrication Facility.'' |
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− | * All supply water to the Nanofab will be shutoff on Sunday (3/11). Contact [[Tom Reynolds]] with any questions or concerns. ''(3/8/2012)'' |
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+ | <!-- these comments only show up when viewing the page source, but not when the page is viewed normally (eg. the RSS feed) --> |
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+ | <!-- |
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+ | '''How to add news items''' |
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+ | |||
+ | * New news item should be inserted at the TOP of the list |
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+ | * Item titles should have a level 3 heading, like so: === MyArticleTitle === |
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+ | * Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line. When you 'Save' the page, this will be replaced with a timestamp and your user name. |
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+ | * Then delete your username, leaving only the two dashes, so "[[User:Thibeault|-- Brain Thibeault]]" becomes "[[User:Thibeault|-- ]]" |
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+ | * Also delete the "[[... (talk)]]" link |
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+ | * The timestamp determines the order of items in the feed. Items without a timestamp will show up at the end of the feed in random order. |
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+ | --> |
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+ | <!----------------------------------------------> |
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+ | <!-------- NEWS ITEMS: newest on top --------> |
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+ | |||
+ | === Oxford PlasmaPro ICP Etcher installed === |
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+ | We have a new ICP etcher in Bay 2: |
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+ | [[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]] |
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+ | |||
+ | The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.) |
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+ | |||
+ | In addition, the tool is capable of Atomic Layer Etching on various materials. Contact [[Tony_Bosch | the supervisor]] for training. |
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+ | // [[User:John d|John d]] 11:27, 29 September 2021 (PDT) |
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+ | |||
+ | === SiO2 etching, High-Aspect Ratio === |
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+ | [[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. |
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+ | |||
+ | Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]]. |
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+ | |||
+ | You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography. |
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+ | // [[User:John d|John d]] 08:05, 27 May 2021 (PDT) |
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+ | |||
+ | === Wafer Polisher available === |
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+ | We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information. // [[User:John d|John d]] 16:49, 10 May 2021 (PDT) |
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+ | |||
+ | === Digital Microscope: Olympus DSX-1000 === |
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+ | You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails. |
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+ | // [[User:John d|John d]] 13:49, 8 April 2021 (PDT) |
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+ | |||
+ | === Raith Velion: FIB/SEM Installation === |
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+ | We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. |
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+ | The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography. |
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+ | |||
+ | Learn more about the tool's capabilities at the Raith website: |
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+ | * [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion]. |
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+ | * [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM] |
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+ | |||
+ | Tool qualification is currently underway. |
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+ | [[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool. |
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+ | |||
+ | // [[User:John d|John d]] 06:53, 30 November 2020 (PST) |
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+ | |||
+ | <!---------- end of announcements ------------> |
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+ | <!----------------------------------------------> |
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+ | <!--DO NOT EDIT BELOW THIS LINE--> |
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+ | <endfeed /> |
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+ | <noinclude>[[Category:Templates]]</noinclude> |
Revision as of 12:36, 7 January 2022
News from the U.C. Santa Barbara Nanofabrication Facility.
Oxford PlasmaPro ICP Etcher installed
We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)
The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)
SiO2 etching, High-Aspect Ratio
Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.
Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.
You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)
Wafer Polisher available
We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)
Digital Microscope: Olympus DSX-1000
You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)
Raith Velion: FIB/SEM Installation
We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
Learn more about the tool's capabilities at the Raith website:
- Raith Products: Velion.
- VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM
Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.
// John d 06:53, 30 November 2020 (PST)