Difference between revisions of "Template:News"

Revision as of 12:36, 7 January 2022

News from the U.C. Santa Barbara Nanofabrication Facility.

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)

@@ Line 17: / Line 17: @@
 <!-------- NEWS ITEMS: newest on top -------->
-=== TechTalk: Dr. Garett Cole & Songtao Liu ===
+=== Oxford PlasmaPro ICP Etcher installed ===
-[https://www.nanotech.ucsb.edu/wiki/index.php/Tech_Talks_Seminar_Series#Thursday.2C_Sept._5.2C_12pm.2C_ESB1001.2C_Light_Lunch_Provided Tech Talks on Wed Sept 4th]:
+We have a new ICP etcher in Bay 2:
+[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
-In ESB room 2001,
+The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
-am: Dr. Garrett Cole,
+In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
-pm: Songtao Liu,
+// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
-=== New Plasma Asher Installation ===
+=== SiO2 etching, High-Aspect Ratio ===
-A new [https://www.yieldengineering.com/Products/Plasma-Strip-Descum-Systems/YES-ÉcoClean ''YES EcoClean Plasma Strip/Descum System''] is being installed, for controlled photoresist etching & residue stripping.  We will make an announcement when the system has been qualified and is ready for use.
+[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask.
-// [[User:John d|John d]] 11:03, 7 August 2019 (PDT)
-=== Rapid Thermal Annealer Installed ===
+Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
-We are installing and qualifying a new [http://ssi-rtp.com/page/products/rtp-solaris-150/ SSI ''Solaris 150 Rapid Thermal Processor''].  We will make an announcement when the system is ready and trainings are scheduled.  See the [[Rapid Thermal Processor (SSI Solaris 150)|SSI RTP Wiki Page here]].
-// [[User:John d|John d]] 12:03, 28 May 2019 (PDT)
-=== S-Cubed Spin/Coat/Dev Station Installation ===
+You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
-We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers.  Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for [[Stepper 3 (ASML DUV)|ASML DUV Stepper]] wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well.
+// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
-// [[User:John d|John d]] 12:10, 20 February 2019 (PST)
-=== Filmetrics Optical Profilometer ===
+=== Wafer Polisher available ===
-A new [https://www.filmetrics.com/profilometers/profilm3d Filmetrics Profilm3D] optical profilometer is being qualified. The system complements the [[Laser_Scanning_Confocal_M-scope_(Olympus_LEXT)|LEXT Confocal Microscope]] and [[Atomic Force Microscope (Bruker ICON)|AFM]], by providing large-area profiles (~5-10mm square) with nanometer-level height resolution, and possibly a fast surface roughness measurement.  See the [[White-Light/Phase-Shift_Interference_Profilometer_(Filmetrics_Profilm3D)|Profilm3D Wiki Page]] for more info on the capabilities and techniques.
+We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
-// [[User:John d|John d]] 10:59, 14 December 2018 (PST)
-=== Filmetrics Optical Measurement Systems ===
+=== Digital Microscope: Olympus DSX-1000 ===
-A [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Filmetrics F10-RT]] for optical reflection/transmission spectra, and a [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Filmetrics F50]] thin-film wafer-mapping system have been installed.  Contact Ning Cao for more info.
+You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
-// [[User:John d|John d]] 15:24, 12 December 2018 (PST)
+// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
-=== KLA Tencor Profilometer Installed ===
+=== Raith Velion: FIB/SEM Installation ===
-We have purchased a new [[Step Profilometer (KLA Tencor P-7)|KLA Tencor Stylus Profilometer]], that has been installed in Bay 4.
+We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
-// [[User:John d|John d]] 17:28, 12 September 2018 (PDT)
+The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
-=== Laser Endpoint Monitors ===
+Learn more about the tool's capabilities at the Raith website:
-We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] & [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]] etchers.  This allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes.
+* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
-// [[User:John d|John d]] 09:26, 17 July 2018 (PDT)
+* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
-=== Metal Processes on the Atomic Layer Deposition ===
+Tool qualification is currently underway.
-We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool.  See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
+[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
-// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
-=== New Deep Silicon Etcher Online ===
+// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
-A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
-// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
-=== 2016 Survey Results ===
-See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.
-// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
-=== CAIBE Ion Mill Available ===
-The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.
-// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
-=== NanoFiles SFTP Online ===
-Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.
-// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
 <!---------- end of announcements ------------>