Difference between revisions of "Template:News"

Revision as of 12:36, 7 January 2022

News from the U.C. Santa Barbara Nanofabrication Facility.

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)

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-=== Laser Endpoint Monitors ===
-We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] etchers.  We are in the process of installing one onto [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]].
+=== Oxford PlasmaPro ICP Etcher installed ===
-[[User:John d|// Posted:]] 11:53, 9 February 2018 (PST)
+We have a new ICP etcher in Bay 2:
+[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
+The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
+In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
-=== Metal Processes on the Atomic Layer Deposition ===
+// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
-We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool.  See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
-// [[User:John d|John d]] ([[User talk:John d|talk]]) 23:07, 20 February 2018 (PST)
-=== New Deep Silicon Etcher Online ===
+=== SiO2 etching, High-Aspect Ratio ===
+[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask.
-A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
+Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
-[[User:John d|// Posted:]] 22:16, 27 November 2017 (PST)
+You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
+// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
-=== 2016 Survey Results ===
+=== Wafer Polisher available ===
+We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
-See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.
+=== Digital Microscope: Olympus DSX-1000 ===
-[[User:Thibeault|// Posted:]] 12:00, 01 May 2016 (PST)
+You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
+// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
+=== Raith Velion: FIB/SEM Installation ===
+We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
+The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
+Learn more about the tool's capabilities at the Raith website:
-=== CAIBE Ion Mill Available ===
+* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
-The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.
+* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
+Tool qualification is currently underway.
-[[User:Thibeault|// Posted:]] 12:00, 01 July 2015 (PST)
+[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
+// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
-=== NanoFiles SFTP Online ===
-Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.
-[[User:Thibeault|// Posted:]] 12:00, 07 July 2013 (PST)
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