Difference between revisions of "Template:News"

Revision as of 12:36, 7 January 2022

News from the U.C. Santa Barbara Nanofabrication Facility.

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)

@@ Line 1: / Line 1: @@
-<startFeed />
+<startfeed />
+<!---feedBurner name="UCSBNanofab-NewsFeed" /-->
 <!-- Description of the RSS feed -->
-News from the U.C. Santa Barbara Nanofabrication Facility
+''News from the U.C. Santa Barbara Nanofabrication Facility.''
+<!-- these comments only show up when viewing the page source, but not when the page is viewed normally (eg. the RSS feed) -->
+<!--
+'''How to add news items'''
-<!-- Each new news item should be inserted at the TOP of the list, with level 2 heading (==), and finish with user signature (four tildes `~~~~`) -->
+* New news item should be inserted at the TOP of the list
+* Item titles should have a level 3 heading, like so:  === MyArticleTitle ===
+* Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line.  When you 'Save' the page, this will be replaced with a timestamp and your user name.
+* Then delete your username, leaving only the two dashes, so "[[User:Thibeault|-- Brain Thibeault]]" becomes "[[User:Thibeault|-- ]]"
+* Also delete the "[[... (talk)]]" link
+* The timestamp determines the order of items in the feed. Items without a timestamp will show up at the end of the feed in random order.
+-->
+<!---------------------------------------------->
+<!-------- NEWS ITEMS: newest on top -------->
-== New Deep Silicon Etcher ==
+=== Oxford PlasmaPro ICP Etcher installed ===
+We have a new ICP etcher in Bay 2:
-New Plasma-Therm Versaline DSE III DRIE etcher is qualified and available for use.  The new tool features much higher etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. [[User:John d|-- Demis]] ([[User talk:John d|talk]]) 22:16, 27 November 2017 (PST)
+[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
+The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
-== 2016 Survey Results ==
-See the May 2016 User Survey Results:  {{file|Survey052016.pdf|Survey Results}}
+In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
-== CAIBE Ion Mill Available ==
+// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
-The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information. ''(7/2015)''
+=== SiO2 etching, High-Aspect Ratio ===
-== NanoFiles SFTP Online ==
+[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask.
-Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details. ''(7/7/2013)''
+Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
+You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
+// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
+=== Wafer Polisher available ===
+We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
+=== Digital Microscope: Olympus DSX-1000 ===
+You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
+// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
+=== Raith Velion: FIB/SEM Installation ===
+We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
+The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
+Learn more about the tool's capabilities at the Raith website:
+* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
+* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
+Tool qualification is currently underway.
+[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
+// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
+<!---------- end of announcements ------------>
+<!---------------------------------------------->
 <!--DO NOT EDIT BELOW THIS LINE-->
-<endFeed />
+<endfeed />
 <noinclude>[[Category:Templates]]</noinclude>