Difference between revisions of "Template:News"

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=== S-Cubed Spin/Coat/Dev Station Installation ===
 
We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers.  Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for ASML DUV Stepper wafer prep. As procedures are developed, the system will eventually be opened for I-Line stepper use as well.
 
// [[User:John d|John d]] 12:10, 20 February 2019 (PST)
 
  
=== Filmetrics Optical Profilometer ===
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=== Oxford PlasmaPro ICP Etcher installed ===
A new [https://www.filmetrics.com/profilometers/profilm3d Filmetrics Profilm3D] optical profilometer is being qualified. The system complements the [[Laser_Scanning_Confocal_M-scope_(Olympus_LEXT)|LEXT Confocal Microscope]] and [[Atomic Force Microscope (Bruker ICON)|AFM]], by providing large-area profiles (~5-10mm square) with nanometer-level height resolution, and possibly a fast surface roughness measurement.  See the [[White-Light/Phase-Shift_Interference_Profilometer_(Filmetrics_Profilm3D)|Profilm3D Wiki Page]] for more info on the capabilities and techniques.
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We have a new ICP etcher in Bay 2:  
// [[User:John d|John d]] 10:59, 14 December 2018 (PST)
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[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
  
=== Filmetrics Optical Measurement Systems ===
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The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
A [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Filmetrics F10-RT]] for optical reflection/transmission spectra, and a [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Filmetrics F50]] thin-film wafer-mapping system have been installed.  Contact Ning Cao for more info.
 
// [[User:John d|John d]] 15:24, 12 December 2018 (PST)
 
  
=== KLA Tencor Profilometer Installed ===
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In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
We have purchased a new [[Step Profilometer (KLA Tencor P-7)|KLA Tencor Stylus Profilometer]], that has been installed in Bay 4.
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// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
// [[User:John d|John d]] 17:28, 12 September 2018 (PDT)
 
  
=== Laser Endpoint Monitors ===
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=== SiO2 etching, High-Aspect Ratio ===
We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] & [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]] etchersThis allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes.
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask.   
// [[User:John d|John d]] 09:26, 17 July 2018 (PDT)
 
  
=== Metal Processes on the Atomic Layer Deposition ===
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool.  See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
 
// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
 
  
=== New Deep Silicon Etcher Online ===
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
 
  
=== 2016 Survey Results ===
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=== Wafer Polisher available ===
See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.   
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
 
  
=== CAIBE Ion Mill Available ===
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=== Digital Microscope: Olympus DSX-1000 ===
The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.  
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
  
=== NanoFiles SFTP Online ===
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=== Raith Velion: FIB/SEM Installation ===
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.  
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
  
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Learn more about the tool's capabilities at the Raith website:
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion]. 
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
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<noinclude>[[Category:Templates]]</noinclude>
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Tool qualification is currently underway.
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[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
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// [[User:John d|John d]] 06:53, 30 November 2020 (PST)

Latest revision as of 20:30, 29 September 2021

News from the U.C. Santa Barbara Nanofabrication Facility.

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)