Difference between revisions of "Template:News"
| (63 intermediate revisions by 2 users not shown) | |||
| Line 1: | Line 1: | ||
| − | < |
+ | <startfeed /> |
| + | <!---feedBurner name="UCSBNanofab-NewsFeed" /--> |
||
<!-- Description of the RSS feed --> |
<!-- Description of the RSS feed --> |
||
''News from the U.C. Santa Barbara Nanofabrication Facility.'' |
''News from the U.C. Santa Barbara Nanofabrication Facility.'' |
||
| − | <!-- |
+ | <!-- these comments only show up when viewing the page source, but not when the page is viewed normally (eg. the RSS feed) --> |
<!-- |
<!-- |
||
| − | '''How to add |
+ | '''How to add news items''' |
* New news item should be inserted at the TOP of the list |
* New news item should be inserted at the TOP of the list |
||
* Item titles should have a level 3 heading, like so: === MyArticleTitle === |
* Item titles should have a level 3 heading, like so: === MyArticleTitle === |
||
| − | * Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line. When you 'Save' the page, this will be replaced with a timestamp and your user name. |
+ | * Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line. When you 'Save' the page, this will be replaced with a timestamp and your user name. |
| + | * Then delete your username, leaving only the two dashes, so "[[User:Thibeault|-- Brain Thibeault]]" becomes "[[User:Thibeault|-- ]]" |
||
| + | * Also delete the "[[... (talk)]]" link |
||
| + | * The timestamp determines the order of items in the feed. Items without a timestamp will show up at the end of the feed in random order. |
||
--> |
--> |
||
| + | <!----------------------------------------------> |
||
| ⚫ | |||
| + | === Oxford PlasmaPro ICP Etcher installed === |
||
| ⚫ | |||
| + | We have a new ICP etcher in Bay 2: |
||
| − | === New Deep Silicon Etcher Online === |
||
| + | [[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]] |
||
| − | The new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. |
||
| + | The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.) |
||
| ⚫ | |||
| + | In addition, the tool is capable of Atomic Layer Etching on various materials. Contact [[Tony_Bosch | the supervisor]] for training. |
||
| + | // [[User:John d|John d]] 11:27, 29 September 2021 (PDT) |
||
| − | === |
+ | === SiO2 etching, High-Aspect Ratio === |
| + | [[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. |
||
| − | See the May 2016 {{file|Survey052016.pdf| User Survey Results}}. |
||
| + | Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]]. |
||
| − | [[User:Thibeault|-- Brian Thibeault]] 12:00, 01 May 2016 (PST) |
||
| + | You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography. |
||
| + | // [[User:John d|John d]] 08:05, 27 May 2021 (PDT) |
||
| − | === |
+ | === Wafer Polisher available === |
| − | + | We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information. // [[User:John d|John d]] 16:49, 10 May 2021 (PDT) |
|
| + | === Digital Microscope: Olympus DSX-1000 === |
||
| − | [[User:Thibeault|-- ]] 12:00, 01 July 2015 (PST) |
||
| + | You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails. |
||
| + | // [[User:John d|John d]] 13:49, 8 April 2021 (PDT) |
||
| + | === Raith Velion: FIB/SEM Installation === |
||
| + | We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. |
||
| + | The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography. |
||
| + | Learn more about the tool's capabilities at the Raith website: |
||
| − | === NanoFiles SFTP Online === |
||
| + | * [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion]. |
||
| − | Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details. |
||
| + | * [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM] |
||
| + | Tool qualification is currently underway. |
||
| − | [[User:Thibeault|-- Brian Thibeault]] 12:00, 07 July 2013 (PST) |
||
| + | [[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool. |
||
| ⚫ | |||
| − | |||
| − | |||
| − | <!--DO NOT EDIT BELOW THIS LINE--> |
||
| − | <endFeed /> |
||
| − | <noinclude>[[Category:Templates]]</noinclude> |
||
Revision as of 21:30, 29 September 2021
News from the U.C. Santa Barbara Nanofabrication Facility.
Oxford PlasmaPro ICP Etcher installed
We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)
The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)
SiO2 etching, High-Aspect Ratio
Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.
Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.
You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)
Wafer Polisher available
We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)
Digital Microscope: Olympus DSX-1000
You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)
Raith Velion: FIB/SEM Installation
We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
Learn more about the tool's capabilities at the Raith website:
- Raith Products: Velion.
- VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM
Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.
// John d 06:53, 30 November 2020 (PST)