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=== Laser Endpoint Monitors ===
 
We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] etchers.  We are in the process of installing one onto [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]].
 
// [[User:John d|Posted:]] 11:53, 9 February 2018 (PST)
 
  
=== Metal Processes on the Atomic Layer Deposition ===
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=== SiO2 etching, High-Aspect Ratio ===
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool.  See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. 
// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
 
  
=== New Deep Silicon Etcher Online ===
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
 
// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
 
  
=== 2016 Survey Results ===
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
 
  
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=== Wafer Polisher available ===
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
  
=== CAIBE Ion Mill Available ===
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=== Digital Microscope: Olympus DSX-1000 ===
The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.  
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
  
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=== Raith Velion: FIB/SEM Installation ===
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
  
=== NanoFiles SFTP Online ===
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Learn more about the tool's capabilities at the Raith website:
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.  
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
  
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Tool qualification is currently underway.
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[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
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// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
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Revision as of 14:59, 31 August 2021

News from the U.C. Santa Barbara Nanofabrication Facility.

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)