Difference between revisions of "Template:News"

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=== Laser Endpoint Monitors ===
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We've installed new [[http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection]] monitoring on the DSEiii & ICP#2 etchers. We are in the process of installing one onto ICP#1.
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[[User:John d|John d]] ([[User talk:John d|talk]]) 11:53, 9 February 2018 (PST)
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=== Metal Processes on the Atomic Layer Deposition ===
 
=== Metal Processes on the Atomic Layer Deposition ===
 
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool. See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
 
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool. See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
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=== New Deep Silicon Etcher Online ===
 
=== New Deep Silicon Etcher Online ===
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer.
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A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
   
 
[[User:John d|-- ]] 22:16, 27 November 2017 (PST)
 
[[User:John d|-- ]] 22:16, 27 November 2017 (PST)

Revision as of 12:53, 9 February 2018

News from the U.C. Santa Barbara Nanofabrication Facility.

Laser Endpoint Monitors

We've installed new [Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the DSEiii & ICP#2 etchers. We are in the process of installing one onto ICP#1. John d (talk) 11:53, 9 February 2018 (PST)


Metal Processes on the Atomic Layer Deposition

We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the Oxford FlexAL ALD tool. See the Atomic Layer Deposition: Recipes page or contact Bill Mitchell for more information.


New Deep Silicon Etcher Online

A new Plasma-Therm Versaline DSE III DRIE etcher has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.

-- 22:16, 27 November 2017 (PST)


2016 Survey Results

See the May 2016 User Survey Results.

-- 12:00, 01 May 2016 (PST)


CAIBE Ion Mill Available

The CAIBE (Oxford Ion Mill) is up and running! Contact Brian Lingg for more information.

-- 12:00, 01 July 2015 (PST)


NanoFiles SFTP Online

Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check SignupMonkey for details.

-- 12:00, 07 July 2013 (PST)