Template:Announcements

UCSB NanoFab Announcements

SEM#2: Down

The loading arm has been damaged beyond simple repair. JEOL is overnighting us a new load arm. We should receive the arm sometime late morning tomorrow so if the install goes well (and there is no other damage to the tool) the SEM should be available to use Friday afternoon. // John d 11:33, 26 July 2018 (PDT)

Ebeam#2: heater inoperable

The heater is damaged beyond our ability to repair it. We have contacted the vendor and asked for an "expedited" repair if possible. // John d 13:51, 25 July 2018 (PDT)

Sputter #3 UP

We have installed and tested the new solenoid block. Still, make sure to verify the XFER valve is CLOSED before you vent the Loadlock. // John d 11:49, 24 July 2018 (PDT)

Wafer Bonding Furnace Down

Wafer Bonding Tube Furnace (Thermco), is DOWN. // John d 09:30, 24 July 2018 (PDT)

DSE-iii Up

System is ready for use. // John d 13:26, 23 July 2018 (PDT)

PECVD#1: Software Upgrade

We are going to upgrade the computer and software on PECVD#1 in 2–3 weeks. The tool will be down for three to five days. Once the upgrade is complete, everyone will need to be retrained on the new software. You should start planning accordingly, if you use this tool. We will send out an email when we know the exact dates. // John d 15:05, 20 June 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)