Template:Announcements

UCSB NanoFab Announcements

Wafer Bonding Furnace Down

Tube Furnace, Wafer Bonding (Thermco)] Tube Furnace is DOWN. // John d 09:30, 24 July 2018 (PDT)

DSE-iii Up

System is ready for use. // John d 13:26, 23 July 2018 (PDT)

Sputter 3 down

The part we need to repair the system will arrive Tuesday. Please plan on the system being unavailable until noon on Tuesday at the earliest. // John d 17:28, 20 July 2018 (PDT)

PECVD#1: Software Upgrade

We are going to upgrade the computer and software on PECVD#1 in 2–3 weeks. The tool will be down for three to five days. Once the upgrade is complete, everyone will need to be retrained on the new software. You should start planning accordingly, if you use this tool. We will send out an email when we know the exact dates. // John d 15:05, 20 June 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)