Difference between revisions of "Template:Announcements"

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(RIE5 software upgrade)
(EB2 maintenance)
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===== EBeam #2: Scheduled Maintenance =====
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Monday the 17th I will have EB2 down all day for modifications. If possible we will have the system up and running by the end of the day either in it's modified form or as it is now. Please plan accordingly
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// [[User:John d|John d]] 17:13, 12 September 2018 (PDT)
   
 
===== RIE#5: Software Upgrades =====
 
===== RIE#5: Software Upgrades =====

Revision as of 17:13, 12 September 2018

UCSB NanoFab Announcements

EBeam #2: Scheduled Maintenance

Monday the 17th I will have EB2 down all day for modifications. If possible we will have the system up and running by the end of the day either in it's modified form or as it is now. Please plan accordingly // John d 17:13, 12 September 2018 (PDT)

RIE#5: Software Upgrades

RIE#5 Will be down next week from approximately Monday Sept. 17th to Thursday Sept. 20th, for a software upgrade to the same software running on the other PlasmaTherm tools. All users will need to be retrained after the upgrade is complete. // John d 15:16, 11 September 2018 (PDT)

Deep-UV uScope Operational

The DUV Microscope is now repaired and operational. // John d 23:49, 30 August 2018 (PDT)

GCA Stepper Maintenance

The GCA 6300 will be down 09/12/18 thru 09/13/18 from 8:00 am until 6:30 pm both days for service. The GCA Autostep will be down from 09/10/18 thru 09/11/2018 from 8:00 am to 6:30 pm both days for service. The systems will be available for your use both days after 6:30 pm. Please schedule your process accordingly. // John d 15:19, 29 August 2018 (PDT)

PECVD#1: Software Upgrade

Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. // John d 06:38, 15 August 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)