Difference between revisions of "Template:Announcements"
(PECVD software upgrade) |
(EBeam #2 heater repair) |
||
Line 8: | Line 8: | ||
<!----------------------------------------------> |
<!----------------------------------------------> |
||
<!------------- Announcements ----------------> |
<!------------- Announcements ----------------> |
||
⚫ | |||
+ | We will be performing heater repair on Monday Aug. 18th. System should be ready for use Tuesday. |
||
⚫ | |||
+ | |||
===== PECVD#1: Software Upgrade ===== |
===== PECVD#1: Software Upgrade ===== |
||
Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. |
Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. |
||
// [[User:John d|John d]] 06:38, 15 August 2018 (PDT) |
// [[User:John d|John d]] 06:38, 15 August 2018 (PDT) |
||
− | |||
⚫ | |||
− | The heater is damaged beyond our ability to repair it. We have contacted |
||
− | the vendor and asked for an "expedited" repair if possible. |
||
⚫ | |||
===== RIE#5: SiCl4 Issue ===== |
===== RIE#5: SiCl4 Issue ===== |
Revision as of 11:28, 18 August 2018
UCSB NanoFab Announcements
Ebeam#2: heater repair scheduled
We will be performing heater repair on Monday Aug. 18th. System should be ready for use Tuesday. // John d 11:28, 18 August 2018 (PDT)
PECVD#1: Software Upgrade
Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. // John d 06:38, 15 August 2018 (PDT)
RIE#5: SiCl4 Issue
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)