Difference between revisions of "Template:Announcements"
(sem2 down) |
(Sem up) |
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<!------------- Announcements ----------------> |
<!------------- Announcements ----------------> |
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| − | ===== SEM#2: |
+ | ===== SEM#2: up ===== |
| − | The loading arm has been fixed |
+ | The loading arm has been fixed. |
| ⚫ | |||
| − | The gate valve between the loadlock and the main chamber is stuck open. Hence tool is DOWN until we get it fixed. |
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| ⚫ | |||
===== Wafer Bonding Furnace is UP ===== |
===== Wafer Bonding Furnace is UP ===== |
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Revision as of 18:28, 27 July 2018
UCSB NanoFab Announcements
SEM#2: up
The loading arm has been fixed. // John d 18:28, 27 July 2018 (PDT)
Wafer Bonding Furnace is UP
Wafer Bonding Tube Furnace (Thermco), is now UP. // John d 11:35, 26 July 2018 (PDT)
Ebeam#2: heater inoperable
The heater is damaged beyond our ability to repair it. We have contacted the vendor and asked for an "expedited" repair if possible. // John d 13:51, 25 July 2018 (PDT)
Sputter #3 UP
We have installed and tested the new solenoid block. Still, make sure to verify the XFER valve is CLOSED before you vent the Loadlock. // John d 11:49, 24 July 2018 (PDT)
PECVD#1: Software Upgrade
We are going to upgrade the computer and software on PECVD#1 in 2–3 weeks. The tool will be down for three to five days. Once the upgrade is complete, everyone will need to be retrained on the new software. You should start planning accordingly, if you use this tool. We will send out an email when we know the exact dates. // John d 15:05, 20 June 2018 (PDT)
RIE#5: SiCl4 Issue
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)