Surface Analysis (KLA/Tencor Surfscan)

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Surface Analysis (KLA/Tencor Surfscan)
KLA.jpg
Location Bay 5
Tool Type Inspection, Test and Characterization
Manufacturer Tencor
Description Surface Analysis
KLA/Tencor Surfscan

Primary Supervisor Biljana Stamenic
(805) 893-4002
biljana@ece.ucsb.edu

Secondary Supervisor

Don Freeborn


Recipes N/A


About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface.

It can scan wafers in size from 4 to 8 inches. Piece-parts are more difficult but can be scanned with a custom recipe.

4-inch wafers are the most standard size to measure.

For measuring very low particle counts accurately, purchase "low particle count" (LPC) wafers from a Silicon wafer vendor, and keep the wafers in the case and clean at all times until use.

Documentation

Operating Procedures

Other Documentation

  • Operations Manual
    • For detailed measurement info, it is highly recommended that you read the manual.

Examples

A low-particle 4-inch wafer example:
Gain 4: Small Particles

(0.160µm – 1.60µm)

Gain 2: Large Particles

(1.60µm – 28.0µm)

Surfscan Low-Particle Example - G4.png Surfscan Low-Particle Example - G2.png
A high-particle 4-inch wafer example:
Gain 4: Small Particles

(0.160µm – 1.60µm)

Gain 2: Large Particles

(1.60µm – 28.0µm)

Surfscan - 230113A7 Gain4 high particles.jpg Surfscan 230113A7G2 after low particles.jpg