Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"

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==Documentation==
 
==Documentation==
 
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]]
 
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]]
*[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual]
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*[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual]
 
**''For detailed measurement info, it is highly recommended that you read the manual.''
 
**''For detailed measurement info, it is highly recommended that you read the manual.''
 
*[[Wafer scanning process traveler]]
 
*[[Wafer scanning process traveler]]

Revision as of 18:24, 4 April 2020

Surface Analysis (KLA/Tencor Surfscan)
KLA.jpg
Tool Type Inspection, Test and Characterization
Location Bay 5
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Surface Analysis
KLA/Tencor Surfscan 
Manufacturer Tencor


About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.

Documentation