Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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(added exmaple of low particle count) |
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|location=Bay 5 | |location=Bay 5 | ||
|description = Surface Analysis | |description = Surface Analysis | ||
| − | + | KLA/Tencor Surfscan | |
|manufacturer = Tencor | |manufacturer = Tencor | ||
|materials = | |materials = | ||
|toolid= | |toolid= | ||
}} | }} | ||
| − | =About= | + | ==About== |
| − | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. | + | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches. |
| − | =Documentation= | + | ==Documentation== |
| − | *[[ | + | |
| − | *[[ | + | *[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
| − | + | *[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] | |
| + | **''For detailed measurement info, it is highly recommended that you read the manual.'' | ||
| + | *[[Wafer scanning process traveler]] | ||
| + | *[[Glossary]] | ||
| + | *[[Errors]] | ||
| + | |||
| + | <br /> | ||
| + | |||
| + | == Examples == | ||
| + | <br /> | ||
| + | {| class="wikitable" | ||
| + | |+A low-particle 4-inch wafer example: | ||
| + | !Gain 4: Small Particles | ||
| + | (0.160µm – 1.60µm) | ||
| + | !Gain 2: Large Particles | ||
| + | (1.60µm – 28.0µm) | ||
| + | |- | ||
| + | |[[File:Surfscan Low-Particle Example - G4.png|frameless|200x200px]] | ||
| + | |[[File:Surfscan Low-Particle Example - G2.png|frameless|200x200px]] | ||
| + | |} | ||
| + | {| class="wikitable" | ||
| + | |+A high-particle 4-inch wafer example: | ||
| + | !Gain 4: Small Particles | ||
| + | (0.160µm – 1.60µm) | ||
| + | !Gain 2: Large Particles | ||
| + | (1.60µm – 28.0µm) | ||
| + | |- | ||
| + | |''To Be Added'' | ||
| + | |''To Be Added'' | ||
| + | |} | ||
Latest revision as of 15:09, 18 November 2021
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors
Examples
| Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
|---|---|
|
|
| Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
|---|---|
| To Be Added | To Be Added |