Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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|picture=KLA.jpg |
|picture=KLA.jpg |
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|type = Inspection, Test and Characterization |
|type = Inspection, Test and Characterization |
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| − | |super= |
+ | |super= Biljana Stamenic |
|location=Bay 5 |
|location=Bay 5 |
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| − | |description = |
+ | |description = Surface Analysis |
| + | KLA/Tencor Surfscan |
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|manufacturer = Tencor |
|manufacturer = Tencor |
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|materials = |
|materials = |
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|toolid= |
|toolid= |
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}} |
}} |
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| + | ==About== |
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| + | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches. |
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| + | |||
| + | ==Documentation== |
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| + | *[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
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| + | *[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
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| + | **''For detailed measurement info, it is highly recommended that you read the manual.'' |
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| + | *[[Wafer scanning process traveler]] |
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| + | *[[Glossary]] |
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| + | *[[Errors]] |
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Revision as of 15:08, 7 April 2020
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors