Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
Jump to navigation
Jump to search
| (6 intermediate revisions by 2 users not shown) | |||
| Line 15: | Line 15: | ||
==Documentation== |
==Documentation== |
||
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
||
| − | *[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
+ | *[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
||
*[[Wafer scanning process traveler]] |
*[[Wafer scanning process traveler]] |
||
| − | *[[ |
+ | *[[Glossary]] |
| + | *[[Errors]] |
||
Revision as of 15:08, 7 April 2020
|
About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors