Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
Jump to navigation
Jump to search
m (→Documentation: minor formating) |
|||
(13 intermediate revisions by 2 users not shown) | |||
Line 11: | Line 11: | ||
}} |
}} |
||
==About== |
==About== |
||
− | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to |
+ | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches. |
==Documentation== |
==Documentation== |
||
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
||
− | *[ |
+ | *[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
||
+ | *[[Wafer scanning process traveler]] |
||
− | *[[media:Surfscan-Surfscan 6200 info.pdf|Surfscan Info]] |
||
+ | *[[Glossary]] |
||
− | |||
+ | *[[Errors]] |
||
− | === Screenshots === |
||
− | [[File:UCSBTEST.png|left|thumb|'''UCSBTEST2''' for big size particles '''(1.6-28.0)um''']][[File:UCSBTEST2 for small particles.png|left|thumb|'''UCSBTEST2''' for small size particles '''(0.16-1.6)um''']] |
Revision as of 15:08, 7 April 2020
|
About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors