Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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| − | =About= |
+ | ==About== |
| − | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to |
+ | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches. |
| − | =Documentation= |
+ | ==Documentation== |
| + | *[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
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| − | *[ |
+ | *[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
| − | *[[media:Surfscan-Surfscan 6200 info.pdf|Surfscan Info]] |
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| + | **''For detailed measurement info, it is highly recommended that you read the manual.'' |
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| − | *[[Surfscan6200 photos]] |
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| + | *[[Wafer scanning process traveler]] |
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| + | *[[Glossary]] |
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| + | *[[Errors]] |
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Revision as of 15:08, 7 April 2020
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors