Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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=About= |
=About= |
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| − | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It could scan from 4 to 6 |
+ | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It could scan wafers in size from 4 to 6 inches. |
=Documentation= |
=Documentation= |
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Revision as of 10:16, 12 April 2016
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It could scan wafers in size from 4 to 6 inches.