Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"

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*[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual]
 
*[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual]
 
**''For detailed measurement info, it is highly recommended that you read the manual.''
 
**''For detailed measurement info, it is highly recommended that you read the manual.''
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*[[Wafer scanning process traveler]]
*[//wiki.nanotech.ucsb.edu/w/images/2/27/Surfscan-Surfscan_6200_info.pdf Surfscan Info]
 
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*
 
=== Screenshots ===
 
[[File:UCSBTEST.png|left|thumb|'''UCSBTEST2''' for big size particles '''(1.6-28.0)um''']][[File:UCSBTEST2 for small particles.png|left|thumb|'''UCSBTEST2''' for small size particles '''(0.16-1.6)um''']]
 

Revision as of 17:17, 31 March 2020

Surface Analysis (KLA/Tencor Surfscan)
KLA.jpg
Tool Type Inspection, Test and Characterization
Location Bay 5
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Surface Analysis
KLA/Tencor Surfscan 
Manufacturer Tencor


About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.

Documentation