Difference between revisions of "Step Profilometer (KLA Tencor P-7)"
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|picture=KLA-Tencor-P7_Photo.JPG |
|picture=KLA-Tencor-P7_Photo.JPG |
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|type = Inspection, Test and Characterization |
|type = Inspection, Test and Characterization |
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| − | |super= |
+ | |super= Bill Millerski |
| + | |super2= Aidan Hopkins |
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|phone=(805)839-3918x210 |
|phone=(805)839-3918x210 |
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|location=Bay 4 |
|location=Bay 4 |
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}} |
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==About== |
==About== |
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| + | The KLA-Tencor P7 profilometer is a stylus profilometer that drags a stylus across the wafer surface with controlled pressure, aligned via microcope, and measures the step-heights of surface features during the measurement. The system has a motor-controlled stage for X/Y/Rotation, and is typically used to measure step heights in single areas on various sample sizes frmo small pieces to 4-inch wafers. It can be programmed to scan multiple locations on a single wafer or 3D areas topography. |
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| − | The KLA Tencor info will be here |
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==Detailed Specifications== |
==Detailed Specifications== |
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| − | *Probe Tip |
+ | *Probe Tip: 2um radius and 60° angle |
| − | *Maximum wafer size: |
+ | *Maximum wafer size: 6-inch |
*1D Profile and 2D Raster Scanning |
*1D Profile and 2D Raster Scanning |
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| + | *Automated Measurement Routines |
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| − | *Lateral Resolution: _____ |
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| − | *Height Resolution: _____ |
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==Instructions== |
==Instructions== |
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| − | *[[KLA Tencor P7 - Basic profile instructions| |
+ | *[[KLA Tencor P7 - Basic profile instructions|KLA Tencor Operation Procedure]] |
*[[KLA Tencor P7 - Saving Profile Data|Saving+Extracting Profile Data]] |
*[[KLA Tencor P7 - Saving Profile Data|Saving+Extracting Profile Data]] |
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Latest revision as of 23:06, 4 April 2024
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About
The KLA-Tencor P7 profilometer is a stylus profilometer that drags a stylus across the wafer surface with controlled pressure, aligned via microcope, and measures the step-heights of surface features during the measurement. The system has a motor-controlled stage for X/Y/Rotation, and is typically used to measure step heights in single areas on various sample sizes frmo small pieces to 4-inch wafers. It can be programmed to scan multiple locations on a single wafer or 3D areas topography.
Detailed Specifications
- Probe Tip: 2um radius and 60° angle
- Maximum wafer size: 6-inch
- 1D Profile and 2D Raster Scanning
- Automated Measurement Routines