Difference between revisions of "Sputtering Recipes"

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* Stress ≈ -1756MPa (compressive)
 
* Stress ≈ -1756MPa (compressive)
  
*{{fl|IBD-SiN-recipe.pdf|Recipe: SiN_dep}}
+
*{{fl|File:Web_Operational_Procedure_EB4_Rev_3.pdf|Recipe: SiN_dep}}
 
*{{fl|SiNfilm.pdf|SiN Film Data (IBD)}}
 
*{{fl|SiNfilm.pdf|SiN Film Data (IBD)}}
 
*{{fl|SiNrecipedetails.pdf|SiN Recipe Details (IBD)}}
 
*{{fl|SiNrecipedetails.pdf|SiN Recipe Details (IBD)}}

Revision as of 10:19, 16 August 2013

Back to Vacuum Deposition Recipes.

Sputter 1 (Custom)

Sputter 2 (SFI Endeavor)

Sputter 3 (AJA ATC 2000-F)

Sputter 4 (AJA ATC 2200-V)

Sputter 5 (Lesker AXXIS)

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.

All users are required to enter their calibration deps (simple test deps only)


SiO2 deposition (IBD)

  • Refractive Index: ≈1.485
  • Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -320MPa (compressive)

Si3N4 deposition (IBD)

  • Refractive Index ≈ 2.01
  • Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -1756MPa (compressive)

Ta2O5 deposition (IBD)

  • Refractive Index ≈ 2.10
  • Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -140MPa (compressive)

TiO2 deposition (IBD)