Difference between revisions of "Sputtering Recipes"
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(→SiN deposition (IBD): added rate, index, stress) |
(→Ta{{sub|2}}O{{sub|5}} deposition (IBD): added reate, index, stress) |
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==Ta{{sub|2}}O{{sub|5}} deposition (IBD)== |
==Ta{{sub|2}}O{{sub|5}} deposition (IBD)== |
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| + | * Refractive Index ≈ 2.10 |
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| + | * Rate ≈7.8nm/min (users must calibrate this prior to critical deps) |
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| + | * Stress ≈ -140MPa (compressive) |
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| + | |||
*{{fl|IBD-Ta2O5-Recipe.pdf|Ta{{sub|2}}O{{sub|5}} dep}} |
*{{fl|IBD-Ta2O5-Recipe.pdf|Ta{{sub|2}}O{{sub|5}} dep}} |
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Revision as of 12:44, 13 August 2013
Back to Vacuum Deposition Recipes.
Sputter 1 (Custom)
Sputter 2 (SFI Endeavor)
Sputter 3 (AJA ATC 2000-F)
Sputter 4 (AJA ATC 2200-V)
Sputter 5 (Lesker AXXIS)
Ion Beam Deposition (Veeco NEXUS)
IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.
SiO2 deposition (IBD)
- SiO2 dep
- Refractive Index: ≈1.485
- Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -320MPa (compressive)
SiN deposition (IBD)
- Refractive Index ≈ 2.01
- Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -1756MPa (compressive)
Ta2O5 deposition (IBD)
- Refractive Index ≈ 2.10
- Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -140MPa (compressive)