Difference between revisions of "Sputtering Recipes"

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(→‎SiN deposition (IBD): added rate, index, stress)
(→‎Ta{{sub|2}}O{{sub|5}} deposition (IBD): added reate, index, stress)
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==Ta{{sub|2}}O{{sub|5}} deposition (IBD)==
 
==Ta{{sub|2}}O{{sub|5}} deposition (IBD)==
 +
* Refractive Index ≈ 2.10
 +
* Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
 +
* Stress ≈ -140MPa (compressive)
 +
 
*{{fl|IBD-Ta2O5-Recipe.pdf|Ta{{sub|2}}O{{sub|5}} dep}}
 
*{{fl|IBD-Ta2O5-Recipe.pdf|Ta{{sub|2}}O{{sub|5}} dep}}
  
 
==TiO{{sub|2}} deposition (IBD)==
 
==TiO{{sub|2}} deposition (IBD)==
 
*{{fl|IBD-TiO2-Recipe.pdf|TiO{{sub|2}} dep}}
 
*{{fl|IBD-TiO2-Recipe.pdf|TiO{{sub|2}} dep}}

Revision as of 12:44, 13 August 2013

Back to Vacuum Deposition Recipes.

Sputter 1 (Custom)

Sputter 2 (SFI Endeavor)

Sputter 3 (AJA ATC 2000-F)

Sputter 4 (AJA ATC 2200-V)

Sputter 5 (Lesker AXXIS)

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.

SiO2 deposition (IBD)

  • SiO2 dep
  • Refractive Index: ≈1.485
  • Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -320MPa (compressive)

SiN deposition (IBD)

  • Refractive Index ≈ 2.01
  • Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -1756MPa (compressive)

Ta2O5 deposition (IBD)

  • Refractive Index ≈ 2.10
  • Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -140MPa (compressive)

TiO2 deposition (IBD)