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  1. (hist) ‎PECVD1-(PlasmaTherm 790) ‎[0 bytes]
  2. (hist) ‎SiN 100C Table-2019 ‎[0 bytes]
  3. (hist) ‎Old training manual ‎[0 bytes]
  4. (hist) ‎Sputter 5 ‎[1 byte]
  5. (hist) ‎Stepper 1 (GCA 6300) Available chucks ‎[3 bytes]
  6. (hist) ‎Unaxis SiN100C 300nm-2019 ‎[6 bytes]
  7. (hist) ‎InP Etch test -details ‎[7 bytes]
  8. (hist) ‎InP Etch Test-in details ‎[7 bytes]
  9. (hist) ‎Stepper 2 (AutoStep 200) - Operating Procedure - Piece Parts ‎[7 bytes]
  10. (hist) ‎PECVD.docx ‎[14 bytes]
  11. (hist) ‎Advanced PECVD Recipes ‎[21 bytes]
  12. (hist) ‎PECV1 Wafer Coating Process Traveler ‎[21 bytes]
  13. (hist) ‎UCSBTEST1Gain4.jpg ‎[21 bytes]
  14. (hist) ‎AUTOSTEP 200-PIECES instruction 6-20-19.pptx ‎[26 bytes]
  15. (hist) ‎Molecular Vapor Deposition Recipes ‎[29 bytes]
  16. (hist) ‎Unaxis SOP 3-12-2020.docx ‎[29 bytes]
  17. (hist) ‎PECVD1-SiN-standard recipe.pdf ‎[30 bytes]
  18. (hist) ‎Surfscan photo ‎[32 bytes]
  19. (hist) ‎E-BEAM ‎[45 bytes]
  20. (hist) ‎Flood Exposure Recipes ‎[46 bytes]
  21. (hist) ‎Exposing a wafer piece ‎[48 bytes]
  22. (hist) ‎Surfscan6200 photos ‎[59 bytes]
  23. (hist) ‎Errors ‎[59 bytes]
  24. (hist) ‎AUTOSTEP 200-PIECES 1st litho BL and BR orientation.pptx ‎[60 bytes]
  25. (hist) ‎Operating Instructions ‎[61 bytes]
  26. (hist) ‎PECVD1 Operating Instructions.pdf ‎[68 bytes]
  27. (hist) ‎Wafer coating procedure ‎[68 bytes]
  28. (hist) ‎STD SiO2 recipe ‎[72 bytes]
  29. (hist) ‎Test Page ‎[88 bytes]
  30. (hist) ‎ADT UV-Tape Table 1042R ‎[89 bytes]
  31. (hist) ‎PECVD1-SiN standard recipe.pdf ‎[90 bytes]
  32. (hist) ‎InP Etch Test Result in Details ‎[90 bytes]
  33. (hist) ‎InP etch result in details ‎[94 bytes]
  34. (hist) ‎GCA Old full training manual ‎[98 bytes]
  35. (hist) ‎ProcessGroup: Shipping Samples on Dicing Tape+Frame ‎[113 bytes]
  36. (hist) ‎SPR220-7 at 3kW various temperature without N2 gas ‎[118 bytes]
  37. (hist) ‎Old Training Manual ‎[120 bytes]
  38. (hist) ‎Autostep 200 Old training manual ‎[120 bytes]
  39. (hist) ‎TEST PAGE ‎[126 bytes]
  40. (hist) ‎Surfscan Errors and Workarounds ‎[133 bytes]
  41. (hist) ‎YES-SPR220-Various-Temps ‎[135 bytes]
  42. (hist) ‎Jack Whaley ‎[144 bytes]
  43. (hist) ‎Adam Abrahamsen ‎[149 bytes]
  44. (hist) ‎Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture. ‎[149 bytes]
  45. (hist) ‎Vacuum Sealer ‎[172 bytes]
  46. (hist) ‎PECVD1-SIN Standard Recipe (PlasmaTherm 790) ‎[174 bytes]
  47. (hist) ‎THz Physics Presentations ‎[186 bytes]
  48. (hist) ‎E-Beam Lithography Recipes ‎[187 bytes]
  49. (hist) ‎Unaxis Test Recipe Page ‎[208 bytes]
  50. (hist) ‎Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe. ‎[223 bytes]
  51. (hist) ‎Michael Barreraz ‎[234 bytes]
  52. (hist) ‎Tino Sy ‎[235 bytes]
  53. (hist) ‎Mike Day ‎[241 bytes]
  54. (hist) ‎Luis Zuzunaga ‎[252 bytes]
  55. (hist) ‎SiO2 Etching Test using CF4/CHF3 ‎[259 bytes]
  56. (hist) ‎Foong Fatt ‎[260 bytes]
  57. (hist) ‎Test Data of etching SiO2 with CHF3/CF4-Florine ‎[264 bytes]
  58. (hist) ‎Dan Read ‎[275 bytes]
  59. (hist) ‎Peder Lenvik ‎[289 bytes]
  60. (hist) ‎Test Data of etching SiO2 with CHF3/CF4/O2 ‎[293 bytes]
  61. (hist) ‎Ovens 1, 2 & 3 (Labline) ‎[301 bytes]
  62. (hist) ‎Mike Silva ‎[309 bytes]
  63. (hist) ‎Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher ‎[322 bytes]
  64. (hist) ‎Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher ‎[322 bytes]
  65. (hist) ‎Vraj Mehalana ‎[332 bytes]
  66. (hist) ‎Thermal Evaporator 2 ‎[357 bytes]
  67. (hist) ‎Nanofab-IT - Add Device to Network ‎[360 bytes]
  68. (hist) ‎Vacuum Oven (YES) ‎[378 bytes]
  69. (hist) ‎Intellemetrics Laser Etch Monitor Procedure for Plasma-Therm Etchers ‎[422 bytes]
  70. (hist) ‎Critical Point Dryer ‎[430 bytes]
  71. (hist) ‎Bill Mitchell ‎[436 bytes]
  72. (hist) ‎YES-150C-Various-Resists ‎[464 bytes]
  73. (hist) ‎Spin Rinse Dryer (SemiTool) ‎[470 bytes]
  74. (hist) ‎Older Publications ‎[481 bytes]
  75. (hist) ‎ADT 7100 - Recovering an Old Recipe (2019) ‎[487 bytes]
  76. (hist) ‎Claudia Gutierrez ‎[487 bytes]
  77. (hist) ‎Brian Lingg ‎[503 bytes]
  78. (hist) ‎MA6 Backside Alignment - Allowed Mark Locations ‎[504 bytes]
  79. (hist) ‎Electronics Presentations ‎[535 bytes]
  80. (hist) ‎Don Freeborn ‎[543 bytes]
  81. (hist) ‎DS-K101-304 Bake Temp. versus Develop Rate ‎[543 bytes]
  82. (hist) ‎Oven 5 (Labline) ‎[550 bytes]
  83. (hist) ‎Wire Saw (Takatori) ‎[553 bytes]
  84. (hist) ‎Lab Rules OLD 2018 ‎[574 bytes]
  85. (hist) ‎ASML 5500: Recovering from a Typo in Reticle ID ‎[576 bytes]
  86. (hist) ‎High Temp Oven (Blue M) ‎[647 bytes]
  87. (hist) ‎YES Recipe Screenshots: STD-O2 ‎[669 bytes]
  88. (hist) ‎Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer) ‎[707 bytes]
  89. (hist) ‎Lee Sawyer ‎[716 bytes]
  90. (hist) ‎YES Recipe Screenshots: STD-N2-O2 ‎[725 bytes]
  91. (hist) ‎Mechanical Polisher (Allied) ‎[734 bytes]
  92. (hist) ‎MVD - Wafer Coating - Process Traveler ‎[775 bytes]
  93. (hist) ‎ASML Stepper 3 - Substrates smaller than 100mm/4-inch ‎[790 bytes]
  94. (hist) ‎Gold Plating Bench ‎[803 bytes]
  95. (hist) ‎Tube Furnace AlGaAs Oxidation (Lindberg) ‎[810 bytes]
  96. (hist) ‎Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond ‎[823 bytes]
  97. (hist) ‎Photonics Presentations ‎[837 bytes]
  98. (hist) ‎Bill Millerski ‎[848 bytes]
  99. (hist) ‎Field Emission SEM 2 (JEOL IT800SHL) ‎[850 bytes]
  100. (hist) ‎Tony Bosch ‎[851 bytes]
  101. (hist) ‎Oven 4 (Thermo-Fisher HeraTherm) ‎[865 bytes]
  102. (hist) ‎Equipment Group - Video Training Procedures ‎[870 bytes]
  103. (hist) ‎Ning Cao ‎[899 bytes]
  104. (hist) ‎Photomask Ordering Procedure for UCSB Users ‎[941 bytes]
  105. (hist) ‎E-Beam 5 (Plasys) ‎[946 bytes]
  106. (hist) ‎Flip-Chip Bonder (Finetech) ‎[948 bytes]
  107. (hist) ‎Stepper 2 (Autostep 200) - Chuck Selection ‎[960 bytes]
  108. (hist) ‎UV Ozone Reactor ‎[961 bytes]
  109. (hist) ‎Thermal Evap 2 (Solder) ‎[963 bytes]
  110. (hist) ‎UV Ozone Quick Start ‎[989 bytes]
  111. (hist) ‎Resistivity Mapper (CDE RESMAP) ‎[995 bytes]
  112. (hist) ‎Chemical-Mechanical Polisher (Logitech) ‎[1,051 bytes]
  113. (hist) ‎Stepper 1 (GCA6300) How to select proper chuck ‎[1,071 bytes]
  114. (hist) ‎Other Dry Etching Recipes ‎[1,075 bytes]
  115. (hist) ‎Plasma Clean (Gasonics 2000) ‎[1,076 bytes]
  116. (hist) ‎Photoluminescence PL Setup (Custom) ‎[1,081 bytes]
  117. (hist) ‎Step Profilometer (KLA Tencor P-7) ‎[1,105 bytes]
  118. (hist) ‎Brian Thibeault ‎[1,116 bytes]
  119. (hist) ‎Process Group - Remote Fabrication Jobs ‎[1,152 bytes]
  120. (hist) ‎ASML 5500: Choose Marks for Prealignment ‎[1,164 bytes]
  121. (hist) ‎SEM Sample Coater (Hummer) ‎[1,181 bytes]
  122. (hist) ‎KLA Tencor P7 - Saving Profile Data ‎[1,185 bytes]
  123. (hist) ‎Strip Annealer ‎[1,204 bytes]
  124. (hist) ‎Wafer Cleaver Recipes (LSD-155LT) ‎[1,213 bytes]
  125. (hist) ‎Plasma Activation (EVG 810) ‎[1,229 bytes]
  126. (hist) ‎Goniometer (Rame-Hart A-100) - Operating Procedure ‎[1,230 bytes]
  127. (hist) ‎Tube Furnace Wafer Bonding (Thermco) ‎[1,241 bytes]
  128. (hist) ‎Ellipsometer (Rudolph) ‎[1,262 bytes]
  129. (hist) ‎Video Training: Uploading to GauchoCast/Panopto (Internal) ‎[1,266 bytes]
  130. (hist) ‎ASML DUV: Edge Bead Removal via Photolithography ‎[1,276 bytes]
  131. (hist) ‎Optical Film Thickness (Filmetrics) ‎[1,279 bytes]
  132. (hist) ‎Ellipsometer (Woollam) - Measuring thin dielectrics with Native Oxide pre-measurement ‎[1,284 bytes]
  133. (hist) ‎Wafer Cleaver (PELCO Flip-Scribe) ‎[1,296 bytes]
  134. (hist) ‎Automated Wafer Cleaver (Loomis LSD-155LT) ‎[1,326 bytes]
  135. (hist) ‎CDE ResMap Quick-Start instructions ‎[1,331 bytes]
  136. (hist) ‎Molecular Vapor Deposition ‎[1,336 bytes]
  137. (hist) ‎Photolithography - Improving Adhesion Photoresist Adhesion ‎[1,363 bytes]
  138. (hist) ‎Aidan Hopkins ‎[1,364 bytes]
  139. (hist) ‎Digital Microscope (Olympus DSX1000) ‎[1,389 bytes]
  140. (hist) ‎HF Vapor Etch ‎[1,399 bytes]
  141. (hist) ‎Deep UV Optical Microscope (Olympus) ‎[1,403 bytes]
  142. (hist) ‎OLD - PECVD2 Recipes ‎[1,406 bytes]
  143. (hist) ‎DUV Flood Expose ‎[1,425 bytes]
  144. (hist) ‎Biljana Stamenic ‎[1,427 bytes]
  145. (hist) ‎Tech Talks Seminar Series ‎[1,466 bytes]
  146. (hist) ‎Laser Etch Monitor Simulation in Python ‎[1,486 bytes]
  147. (hist) ‎Chemical List ‎[1,520 bytes]
  148. (hist) ‎Vapor HF Etch ‎[1,521 bytes]
  149. (hist) ‎Vapor HF Etch (uETCH) ‎[1,525 bytes]
  150. (hist) ‎News Feed ‎[1,540 bytes]
  151. (hist) ‎Ovens - Overview of All Lab Ovens ‎[1,546 bytes]
  152. (hist) ‎Wafer Bonder (SUSS SB6-8E) ‎[1,551 bytes]
  153. (hist) ‎RIE 1 (Custom) ‎[1,596 bytes]
  154. (hist) ‎Film Stress (Tencor Flexus) ‎[1,621 bytes]
  155. (hist) ‎RIE Etching Recipes ‎[1,629 bytes]
  156. (hist) ‎PECVD1 Recipes ‎[1,682 bytes]
  157. (hist) ‎Suss MA-6 Backside Alignment QuickStart ‎[1,690 bytes]
  158. (hist) ‎Fluorescence Microscope (Olympus MX51) ‎[1,721 bytes]
  159. (hist) ‎Oxford Etcher - Sample Size Effect on Etch Rate ‎[1,728 bytes]
  160. (hist) ‎Optical Film Thickness & Wafer-Mapping (Filmetrics F50) ‎[1,758 bytes]
  161. (hist) ‎PECVD1 Wafer Coating Process ‎[1,784 bytes]
  162. (hist) ‎Wafer Bonder (Logitech WBS7) ‎[1,815 bytes]
  163. (hist) ‎ASML Stepper 3: Wafer Handler Reset Procedure ‎[1,829 bytes]
  164. (hist) ‎Main Page mod ‎[1,839 bytes]
  165. (hist) ‎Optical Film Thickness (Nanometric) ‎[1,851 bytes]
  166. (hist) ‎Holographic Lith/PL Setup (Custom) ‎[1,853 bytes]
  167. (hist) ‎Dicing Saw (ADT) ‎[1,887 bytes]
  168. (hist) ‎Rapid Thermal Processor (SSI Solaris 150) ‎[1,921 bytes]
  169. (hist) ‎KLA Tencor P7 - Basic profile instructions ‎[1,936 bytes]
  170. (hist) ‎Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX) ‎[1,937 bytes]
  171. (hist) ‎Rapid Thermal Processor (AET RX6) ‎[1,949 bytes]
  172. (hist) ‎Sputter 2 (SFI Endeavor) ‎[1,953 bytes]
  173. (hist) ‎Nano-Imprint (Nanonex NX2000) ‎[1,957 bytes]
  174. (hist) ‎PECVD1 Wafer Coating Process Traveler ‎[1,965 bytes]
  175. (hist) ‎MLA150 - CAD Files and Templates ‎[1,974 bytes]
  176. (hist) ‎Usage Data and Statistics ‎[1,976 bytes]
  177. (hist) ‎ASML Stepper 3 - Job Creator ‎[1,997 bytes]
  178. (hist) ‎XeF2 Etch (Xetch) ‎[2,002 bytes]
  179. (hist) ‎PECVD 2 (Advanced Vacuum) ‎[2,016 bytes]
  180. (hist) ‎E-Beam 3 (Temescal) ‎[2,043 bytes]
  181. (hist) ‎Hummer SEM Sample Coater - Techniques to reduce charging in SEMs ‎[2,046 bytes]
  182. (hist) ‎Sputter 1 (Custom) ‎[2,049 bytes]
  183. (hist) ‎Step Profilometer (DektakXT) ‎[2,072 bytes]
  184. (hist) ‎E-Beam 4 (CHA) ‎[2,099 bytes]
  185. (hist) ‎ASML 5500: Recovering from an Error ‎[2,147 bytes]
  186. (hist) ‎E-Beam 2 (Custom) ‎[2,169 bytes]
  187. (hist) ‎Focused Ion-Beam Lithography (Raith Velion) ‎[2,176 bytes]
  188. (hist) ‎ICP-Etch (Unaxis VLR) ‎[2,180 bytes]
  189. (hist) ‎DUMMY TOOL ‎[2,184 bytes]
  190. (hist) ‎Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement ‎[2,185 bytes]
  191. (hist) ‎Atomic Force Microscope (Bruker ICON) ‎[2,188 bytes]
  192. (hist) ‎Tom Reynolds ‎[2,197 bytes]
  193. (hist) ‎Wafer Scanning process Traveler ‎[2,201 bytes]
  194. (hist) ‎Autostep 200 Troubleshooting and Recovery ‎[2,210 bytes]
  195. (hist) ‎RIE5 - Standard Operating procedure (Cortex Software) ‎[2,218 bytes]
  196. (hist) ‎IR Aligner (SUSS MJB-3 IR) ‎[2,225 bytes]
  197. (hist) ‎Nanofab New User Onboarding ‎[2,289 bytes]
  198. (hist) ‎Automated Coat/Develop System (S-Cubed Flexi) ‎[2,325 bytes]
  199. (hist) ‎Video Training - Introduction (Internal) ‎[2,328 bytes]
  200. (hist) ‎Video Training: Hosting with Zoom and GacuhoCast/Panopto ‎[2,335 bytes]
  201. (hist) ‎Nanofab Staff Internal Pages ‎[2,356 bytes]
  202. (hist) ‎User Accessible Commands ‎[2,363 bytes]
  203. (hist) ‎Ashers (Technics PEII) ‎[2,387 bytes]
  204. (hist) ‎E-Beam 1 (Sharon) ‎[2,410 bytes]
  205. (hist) ‎S-Cubed Flexi - Operating Procedure ‎[2,416 bytes]
  206. (hist) ‎NanoFab Process Group ‎[2,434 bytes]
  207. (hist) ‎Autostep 200 User Accessible Commands ‎[2,465 bytes]
  208. (hist) ‎Probe Station: I-V Curves with Keithley 2400 and Python Script ‎[2,493 bytes]
  209. (hist) ‎Ellipsometer (Woollam) ‎[2,494 bytes]
  210. (hist) ‎Thermal Evaporator 1 ‎[2,554 bytes]
  211. (hist) ‎Thermal Evap 1 ‎[2,583 bytes]
  212. (hist) ‎IR Thermal Microscope (QFI) ‎[2,613 bytes]
  213. (hist) ‎Wafer Coating Process Traveler ‎[2,618 bytes]
  214. (hist) ‎Surface Analysis (KLA/Tencor Surfscan) ‎[2,620 bytes]
  215. (hist) ‎GCA 6300 USer Accessible Commands ‎[2,625 bytes]
  216. (hist) ‎Nick test ‎[2,639 bytes]
  217. (hist) ‎PECVD 1 (PlasmaTherm 790) ‎[2,653 bytes]
  218. (hist) ‎Atomic Layer Deposition (Oxford FlexAL) ‎[2,653 bytes]
  219. (hist) ‎RIE 5 (PlasmaTherm) ‎[2,697 bytes]
  220. (hist) ‎Photolithography - Manual Edge-Bead Removal Techniques ‎[2,720 bytes]
  221. (hist) ‎ASML Stepper 3 Dicing Guide Programming ‎[2,732 bytes]
  222. (hist) ‎RIE 2 (MRC) ‎[2,744 bytes]
  223. (hist) ‎Process Group - Lab Stocking/Supplies Tasks ‎[2,745 bytes]
  224. (hist) ‎MLA150 - Large Image GDS Generation ‎[2,818 bytes]
  225. (hist) ‎Sputter 5 (AJA ATC 2200-V) ‎[2,829 bytes]
  226. (hist) ‎Research ‎[2,890 bytes]
  227. (hist) ‎Homepage Draft1 ‎[3,024 bytes]
  228. (hist) ‎ICP Etch 2 (Panasonic E626I) ‎[3,042 bytes]
  229. (hist) ‎ICP-PECVD (Unaxis VLR) ‎[3,057 bytes]
  230. (hist) ‎Main Page ‎[3,073 bytes]
  231. (hist) ‎RIE 3 (MRC) ‎[3,100 bytes]
  232. (hist) ‎Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences ‎[3,111 bytes]
  233. (hist) ‎Demis D. John ‎[3,134 bytes]
  234. (hist) ‎Laser Scanning Confocal M-scope (Olympus LEXT) ‎[3,161 bytes]
  235. (hist) ‎Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick ‎[3,233 bytes]
  236. (hist) ‎Sputter 3 (AJA ATC 2000-F) ‎[3,240 bytes]
  237. (hist) ‎Plasma Clean (YES EcoClean) ‎[3,283 bytes]
  238. (hist) ‎SEM 1 (JEOL IT800SHL) ‎[3,332 bytes]
  239. (hist) ‎GCA 6300 Reboot Procedures ‎[3,344 bytes]
  240. (hist) ‎Wafer Scanning/Coating Process Traveler ( combined/less detailed) ‎[3,369 bytes]
  241. (hist) ‎Sputter 4 (AJA ATC 2200-V) ‎[3,457 bytes]
  242. (hist) ‎MLA Recipes ‎[3,571 bytes]
  243. (hist) ‎InP Etch Rate and Selectivity (InP/SiO2) ‎[3,591 bytes]
  244. (hist) ‎Probe Station & Curve Tracer ‎[3,673 bytes]
  245. (hist) ‎Oxford ICP Etcher (PlasmaPro 100 Cobra) ‎[3,696 bytes]
  246. (hist) ‎Ion Beam Deposition (Veeco NEXUS) ‎[3,730 bytes]
  247. (hist) ‎CAIBE (Oxford Ion Mill) ‎[3,758 bytes]
  248. (hist) ‎Filmetrics F40-UV Quick Start ‎[3,839 bytes]
  249. (hist) ‎CC-PRIME OnBoarding 2022-08 ‎[3,879 bytes]
  250. (hist) ‎Lift-Off with DUV Imaging + PMGI Underlayer ‎[3,932 bytes]
  251. (hist) ‎Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP) ‎[3,952 bytes]
  252. (hist) ‎Tube Furnace (Tystar 8300) ‎[4,032 bytes]
  253. (hist) ‎Suss Aligners (SUSS MJB-3) ‎[4,059 bytes]
  254. (hist) ‎Process Group - Billing Instructions ‎[4,061 bytes]
  255. (hist) ‎Measurements and Imaging with Amscope Camera - Quickstart Usage Guide ‎[4,067 bytes]
  256. (hist) ‎Contact Aligner (SUSS MA-6) ‎[4,183 bytes]
  257. (hist) ‎Filmetrics F40-UV Microscope-Mounted ‎[4,218 bytes]
  258. (hist) ‎Nanofab Job Postings ‎[4,246 bytes]
  259. (hist) ‎Troubleshooting and Recovery ‎[4,291 bytes]
  260. (hist) ‎Filmetrics F10-RT-UVX Operating Procedure ‎[4,307 bytes]
  261. (hist) ‎Wafer Coating Process Traveler1 ‎[4,442 bytes]
  262. (hist) ‎ICP Etch 1 (Panasonic E646V) ‎[4,523 bytes]
  263. (hist) ‎Stepper 1 (GCA 6300) ‎[4,669 bytes]
  264. (hist) ‎FIJI - Microscope Measurement Tools ‎[4,694 bytes]
  265. (hist) ‎Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses ‎[4,764 bytes]
  266. (hist) ‎Staff List ‎[4,894 bytes]
  267. (hist) ‎IBD: Calibrating Optical Thickness ‎[4,958 bytes]
  268. (hist) ‎DSEIII (PlasmaTherm/Deep Silicon Etcher) ‎[4,972 bytes]
  269. (hist) ‎Unaxis wafer coating procedure ‎[5,124 bytes]
  270. (hist) ‎Thermal Processing Recipes ‎[5,154 bytes]
  271. (hist) ‎COVID-19 User Policies ‎[5,185 bytes]
  272. (hist) ‎E-Beam Lithography System (JEOL JBX-6300FS) ‎[5,203 bytes]
  273. (hist) ‎Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher ‎[5,423 bytes]
  274. (hist) ‎Thermal Evaporation Recipes ‎[5,427 bytes]
  275. (hist) ‎Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer ‎[5,503 bytes]
  276. (hist) ‎Unaxis VLR Etch - Process Control Data ‎[5,539 bytes]
  277. (hist) ‎Stepper 2 (AutoStep 200) Operating Procedures ‎[5,571 bytes]
  278. (hist) ‎Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers ‎[5,654 bytes]
  279. (hist) ‎Oxygen Plasma System Recipes ‎[5,776 bytes]
  280. (hist) ‎Stepper 1 (GCA 6300) Substrate Thickness, Shim Thickness ans Target Thickness ‎[5,924 bytes]
  281. (hist) ‎Stepper 2 (AutoStep 200) ‎[6,188 bytes]
  282. (hist) ‎Maskless Aligner (Heidelberg MLA150) ‎[6,377 bytes]
  283. (hist) ‎LegacyTable ‎[6,771 bytes]
  284. (hist) ‎Direct-Write Lithography Recipes ‎[6,838 bytes]
  285. (hist) ‎Olympus LEXT OLS4000 Confocal uScope - Quick Start ‎[6,953 bytes]
  286. (hist) ‎Test Data of etching SiO2 with CHF3/CF4-ICP1 ‎[6,982 bytes]
  287. (hist) ‎Autostep 200 Mask Making Guidance ‎[6,986 bytes]
  288. (hist) ‎Test Data of etching SiO2 with CHF3/CF4 ‎[7,016 bytes]
  289. (hist) ‎KLayout Design Tips ‎[7,390 bytes]
  290. (hist) ‎Tool List ‎[7,420 bytes]
  291. (hist) ‎Atomic Layer Deposition Recipes ‎[7,503 bytes]
  292. (hist) ‎E-Beam Evaporation Recipes ‎[8,005 bytes]
  293. (hist) ‎Laser Etch Monitoring ‎[8,426 bytes]
  294. (hist) ‎Oxford ICP Etcher - Process Control Data ‎[8,520 bytes]
  295. (hist) ‎ASML Stepper 3 Error Recovery, Troubleshooting and Calibration ‎[8,656 bytes]
  296. (hist) ‎ASML Stepper 3 Standard Operating Procedure ‎[8,896 bytes]
  297. (hist) ‎Contact Alignment Recipes ‎[9,006 bytes]
  298. (hist) ‎GoPro Hero8 Black (Internal) ‎[9,508 bytes]
  299. (hist) ‎ASML 5500 Mask Making Guidelines ‎[9,519 bytes]
  300. (hist) ‎Stocked Chemical List ‎[9,733 bytes]
  301. (hist) ‎Packaging Recipes ‎[9,760 bytes]
  302. (hist) ‎Process Group - Process Control Data ‎[9,813 bytes]
  303. (hist) ‎Microscopes ‎[9,822 bytes]
  304. (hist) ‎Services ‎[9,841 bytes]
  305. (hist) ‎Wet Etching Recipes ‎[9,931 bytes]
  306. (hist) ‎Filmetrics F50 - Operating Procedure ‎[9,961 bytes]
  307. (hist) ‎Stepper 3 (ASML DUV) ‎[9,987 bytes]
  308. (hist) ‎ASML Stepper 3 - UCSB Test Reticles ‎[10,171 bytes]
  309. (hist) ‎GCA 6300 Mask Making Guidance ‎[10,484 bytes]
  310. (hist) ‎UCSB NanoFab Microscope Training ‎[10,875 bytes]
  311. (hist) ‎ADT 7100 - Initial Setup Before Cutting ‎[11,605 bytes]
  312. (hist) ‎MLA150 - Design Guidelines ‎[12,637 bytes]
  313. (hist) ‎Glossary ‎[12,789 bytes]
  314. (hist) ‎Programming a Job ‎[12,807 bytes]
  315. (hist) ‎Wet Benches ‎[13,520 bytes]
  316. (hist) ‎Dry Etching Recipes ‎[14,072 bytes]
  317. (hist) ‎PECVD Recipes ‎[14,124 bytes]
  318. (hist) ‎Stepper 1 (GCA 6300) - Standard Operating Procedure ‎[14,869 bytes]
  319. (hist) ‎MLA150 - Troubleshooting ‎[15,471 bytes]
  320. (hist) ‎Sputtering Recipes ‎[16,213 bytes]
  321. (hist) ‎Calculators + Utilities ‎[16,377 bytes]
  322. (hist) ‎Stepper Recipes ‎[17,366 bytes]
  323. (hist) ‎Deposition Data - temporary 2021-12-15 ‎[17,583 bytes]
  324. (hist) ‎Editing Tutorials ‎[18,259 bytes]
  325. (hist) ‎Chemical List - OLD 2018-09-05 ‎[19,940 bytes]
  326. (hist) ‎Lithography Recipes ‎[23,636 bytes]
  327. (hist) ‎Vacuum Deposition Recipes ‎[24,066 bytes]
  328. (hist) ‎Frequently Asked Questions ‎[25,692 bytes]
  329. (hist) ‎ICP Etching Recipes ‎[28,398 bytes]
  330. (hist) ‎Old Deposition Data - 2021-12-15 ‎[31,421 bytes]
  331. (hist) ‎Wafer scanning process traveler ‎[34,065 bytes]
  332. (hist) ‎Lab Rules backup ‎[35,139 bytes]
  333. (hist) ‎GCA 6300 training manual -old instructions ‎[35,770 bytes]
  334. (hist) ‎Old Deposition Data - NastaziaM 2021-11-22 ‎[36,993 bytes]
  335. (hist) ‎PubList2018 ‎[78,929 bytes]
  336. (hist) ‎Lab Rules ‎[80,380 bytes]
  337. (hist) ‎Publications - 2013-2014 ‎[102,378 bytes]

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