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- ...0.1C-1.0C/min. Maximum temperature is 200C. There is a N2 purge to provide a dry intert atmosphere during use. |super2= Aidan Hopkins550 bytes (74 words) - 10:21, 30 August 2022
- |super2= Aidan Hopkins Each oven has a temperature that is set by staff only.301 bytes (39 words) - 17:09, 13 September 2022
- |super2= Aidan Hopkins ...to be programmed for a series of custom temperature ramps and holds, with a maximum temperature of 350°C. It is not actively cooled.647 bytes (94 words) - 10:33, 8 September 2022
- |email = hopkins@ece.ucsb.edu ...2017 Aidan became the Facility Staff Manager. Aidan transitioned back to a Senior Development Engineer in 2022.1 KB (195 words) - 17:15, 1 November 2023
- |super2= Aidan Hopkins ...ieces to 4-inch wafers. It can be programmed to scan multiple locations on a single wafer or 3D areas topography.1 KB (157 words) - 15:09, 30 October 2023
- |super= Aidan Hopkins ...L IT800HSL Field Emission Scanning Electron Microscope is used for imaging a variety of samples made in the facility.850 bytes (122 words) - 21:08, 29 February 2024
- |super2= Aidan Hopkins ...g. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.1 KB (172 words) - 11:06, 30 October 2023
- |super= Aidan Hopkins ...ken with normal incidence reflection of white light from the surface using a Deuterium (UV) and Halogen (Vis-nIR) lamps.2 KB (256 words) - 10:03, 13 September 2022
- |super= Aidan Hopkins ...ng the 6.55 um range). The lateral resolution is limited by the tip shape. A video camera with variable magnification allows for manual placement of the2 KB (297 words) - 21:51, 10 May 2023
- |super2= Aidan Hopkins ...imes, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of th865 bytes (115 words) - 16:25, 13 September 2022
- |super= Aidan Hopkins ...aneously measures the optical transmission and reflection spectrum through a thin-film. Subsequent software analysis allows the user to calculate absorb2 KB (268 words) - 10:04, 13 September 2022
- |super= Aidan Hopkins ...l as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipe2 KB (229 words) - 10:53, 20 September 2023
- |super2= Aidan Hopkins The Molecular Vapor deposition system is used for deposition of a monolayer-thick fluorocarbon film for producing extremely hydrophobic surfa1 KB (182 words) - 10:34, 30 August 2022
- |super= Aidan Hopkins ...ranges from 108x - 17,280x satisfy the needs of today's researchers. For a complete description of the tool and its capabilities, please see the above3 KB (471 words) - 09:30, 30 August 2022
- |super2= Aidan Hopkins ...ases, although it can be used to etch As- and Sb-based III-V compounds and a variety of II-VI semiconductors as well. For Al-containing compounds and II3 KB (409 words) - 07:55, 21 July 2023
- |super= Aidan Hopkins ...L IT800HSL Field Emission Scanning Electron Microscope is used for imaging a variety of samples made in the facility.3 KB (487 words) - 21:07, 29 February 2024
- |super2= Aidan Hopkins ..., and other general metalizations. The maximum deposition thickness during a run is limited to 1 micron.2 KB (290 words) - 12:11, 8 September 2022
- |super= Aidan Hopkins ...t consistent, highest resolution AFM imaging technique that can be used on a wide range of sample types.2 KB (301 words) - 11:57, 30 August 2022
- |super2= Aidan Hopkins ...l, adjustable cathode-anode spacing, fixed DC bias or RF power control and a HeNe laser etch monitor with chart recorder. It is turbo pumped and has no3 KB (494 words) - 10:42, 30 August 2022
- |super= Aidan Hopkins The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large gr1 KB (189 words) - 08:16, 26 September 2023
- |super = Aidan Hopkins ...ection spectra between 400-900nm optical wavelengths (Vis to Near-IR) with a regular halogen microscope light source. The Filmetrics software then perfo4 KB (645 words) - 14:28, 29 September 2022
- |super= Aidan Hopkins ...-containing compounds difficult due to the non-volatility of In-chlorides. A high physical component (Ar in the mixture) is required for etching of InP3 KB (390 words) - 10:54, 28 November 2022
- |super2= Aidan Hopkins ...t as top surfaces. Heat is used to increase reaction rate. Treat this as a purely chemical process, accelerated by heat (Arrhenius plot - rate goes up3 KB (497 words) - 12:31, 22 November 2023
- For issues on a particular piece of equipment, please consult the [[Frequently Asked Questi |[[Aidan Hopkins]]5 KB (664 words) - 09:42, 11 March 2024
- |super = Aidan Hopkins |manufacturer = [http://www.jawoollam.com/ J.A. Woollam Co., Inc.]2 KB (333 words) - 15:37, 12 February 2024
- |super2= Aidan Hopkins The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of2 KB (273 words) - 15:11, 17 October 2023
- |super2= Aidan Hopkins ...ka. "FL-ICP"). The system has an Inductively Coupled Plasma (ICP) coil and a capactively coupled substrate RF supply to independently control plasma den4 KB (603 words) - 13:09, 22 November 2023
- |super= Aidan Hopkins ...permitted. The fixturing is configured for 4" diameter Si wafers and uses a clamp to hold the sample on the RF chuck.5 KB (770 words) - 15:17, 15 February 2024
- In the lab we have a total of 16 wet benches. They are divided into the following 8 types as lis |super= Aidan Hopkins13 KB (1,931 words) - 13:24, 21 March 2024