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- #redirect [[Tool_List#Wet Processing]]38 bytes (5 words) - 18:00, 27 June 2012
- #redirect [[Tool_List#Thermal Processing]]42 bytes (5 words) - 18:01, 27 June 2012
- ...r]], or a custom graphite fixture in conjunction with any one of [[Thermal Processing|numerous ovens]], such as the N2-purged [[Tube Furnace Wafer Bonding (Therm [[Category:Processing]]5 KB (713 words) - 16:24, 30 January 2024
- 52 bytes (7 words) - 08:00, 12 July 2012
- 52 bytes (7 words) - 08:00, 12 July 2012
- 52 bytes (7 words) - 08:18, 12 July 2012
Page text matches
- #redirect [[Tool_List#Wet Processing]]38 bytes (5 words) - 18:00, 27 June 2012
- #redirect [[Tool_List#Thermal Processing]]42 bytes (5 words) - 18:01, 27 June 2012
- |type = Wet Processing '''Recipes > Wet Processing > [[Wet Etching Recipes#Gold Plating Bench .28Technic SEMCON 1000.29|Gold P803 bytes (113 words) - 10:27, 1 April 2024
- |type = Thermal Processing |recipe = Thermal Processing2 KB (248 words) - 08:36, 8 December 2023
- ...an 6200. Biljana is available for help and support in any issue related to processing in the cleanroom.1 KB (191 words) - 16:07, 29 December 2023
- *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]3 KB (370 words) - 13:59, 2 November 2023
- *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]3 KB (375 words) - 16:13, 12 March 2024
- ...modules for a variety of nanofabrication processes through direct hands-on processing and results documentation. === Intern - Processing Technician - Thin-Film Characterizations ===4 KB (588 words) - 17:09, 1 April 2024
- |type = Wet Processing470 bytes (71 words) - 11:02, 30 August 2022
- |type = Thermal Processing *[[Thermal Processing Recipes|Thermal Processing Recipes: Tystar 8300]]4 KB (580 words) - 11:15, 7 March 2024
- ...roup]], and is knowledgeable in fabrication techniques and troubleshooting processing issues, along with materials characterization techniques and developing new ...t Demis for inquiries regarding high-resolution lithography & experimental processing tasks.3 KB (434 words) - 10:22, 18 June 2020
- |type = Wet Processing734 bytes (97 words) - 09:06, 15 May 2023
- Processing all kinds of semiconductor devices. with deep process experience: lithogra899 bytes (108 words) - 12:18, 24 March 2020
- |type = Thermal Processing810 bytes (112 words) - 11:13, 30 August 2022
- |type = Thermal Processing1 KB (179 words) - 14:55, 30 October 2023
- |type = Thermal Processing1 KB (170 words) - 11:43, 31 March 2014
- This computer-controlled, turbo-pumped RIE is the "work horse" of the processing laboratory due to it's ease of operation and versatility. It can be operate ...itor and chart recorder. Various devices that use this tool as an integral processing step include: in-plane lasers, VCSELs, micro-lenses, Bragg-Fresnel lens, FE3 KB (390 words) - 10:54, 28 November 2022
- =====Thermal Processing for Photolithography===== =Wet Processing=7 KB (844 words) - 11:52, 1 March 2024
- ...mis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and1 KB (189 words) - 08:16, 26 September 2023
- |type = Wet Processing The facility contains 4 stainless steel solvent benches for general processing using organic solvents. All solvent waste (except for certain chemicals tha13 KB (1,931 words) - 13:24, 21 March 2024
- .../index.php?title=Tool_List#Thermal_Processing See the full list of Thermal Processing tools here.]2 KB (211 words) - 09:41, 24 August 2022
- |type = Thermal Processing2 KB (229 words) - 10:53, 20 September 2023
- ...brication tools and equipment, such as vacuum deposition, etchers, thermal processing etc. ...The Process Group helps to ensure that equipment is providing the expected processing capabilities.5 KB (664 words) - 09:42, 11 March 2024
- |type = Thermal Processing2 KB (268 words) - 14:50, 30 October 2023
- ...ely 10 um, allowing for measurement of thin films at various points in the processing.2 KB (274 words) - 07:30, 13 May 2022
- ...eeexplore.ieee.org/abstract/document/546406/ Etch rates for Micromachining Processing (IEEE Jnl. MEMS, 1996)] - includes tables of etch rates of numerous metals ...re.ieee.org/xpls/abs_all.jsp?arnumber=546406 Etch rates for micromachining processing]10 KB (1,405 words) - 10:34, 1 April 2024
- |type = Wet Processing2 KB (340 words) - 14:41, 8 November 2022
- ...t and versatile FIB patterning for simplified, flexible, 3D, and automated processing2 KB (285 words) - 09:56, 15 March 2021
- ...r]], or a custom graphite fixture in conjunction with any one of [[Thermal Processing|numerous ovens]], such as the N2-purged [[Tube Furnace Wafer Bonding (Therm [[Category:Processing]]5 KB (713 words) - 16:24, 30 January 2024
- ...he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena2 KB (333 words) - 08:29, 7 August 2020
- ...wafer surface before HMDS application. This is very important for wet-etch processing through small, high aspect ratio photoresist holes or lines.2 KB (347 words) - 13:06, 11 November 2022
- ...system is load-locked and can accommodate sample temperatures up to 550°C. Processing temperature windows are defined for each material based on growth limitatio3 KB (377 words) - 14:56, 8 March 2023
- *Clean excess wax off your wafer using the [[Wet Benches#Automated Wet-processing Spinners .28POLOS.29|POLOS Spinners]], and an Acetone squirt bottle, follow3 KB (531 words) - 10:52, 26 April 2023
- ...enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spi ...storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet34 KB (5,514 words) - 11:07, 3 August 2018
- [[Category:Processing]]14 KB (1,875 words) - 15:31, 7 February 2024
- [[Category:Processing]]24 KB (3,097 words) - 15:44, 7 July 2022
- *Glassware for chemical processing (developer/water/solvent/acid/base). Pyrex required for heating. Watch glas ==Processing/Fabrication Questions==25 KB (4,184 words) - 08:59, 21 November 2023
- ...phy_Recipes#Photolithography_Recipes Photolith. Recipes Page] for detailed processing info (bakes/spins/exposure does etc.). Basic photoresists include:6 KB (893 words) - 17:44, 12 February 2024
- ...px|After clicking HELP button on an error window "Fatal error during batch processing", showing the error chain. This shows that the system was unable to pick up8 KB (1,341 words) - 10:36, 15 September 2023
- ...ul for general observations, measurements, inspections after etching/other processing steps, distinguishing residues vs. delamination, to name a few.11 KB (1,710 words) - 12:41, 16 October 2023
- ...inks to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, b [[Category: Processing]]23 KB (3,169 words) - 21:43, 16 February 2023
- *A yellow slot number indicates that the instrument is processing the substrate. ...in highest instrument sensitivity,. but produces the lowest wafer-per-hour processing speed. In general, use the highest throughput that produces acceptable resu33 KB (5,424 words) - 17:05, 4 January 2024
- The Nanofab is not a teaching lab or a course in processing. The users are expected to have prior cleanroom experience and understand a ...s that abrasion of fabric surfaces results in higher particle counts. When processing, try not to scrape the wipes while handling your parts.[[File:Lab Rules - 178 KB (12,785 words) - 10:16, 12 April 2023
- ...b>2</sub>O<sub>3</sub> is extremely high, >9000. See below TSV process for processing notes on this film.28 KB (4,350 words) - 17:09, 9 April 2024
- ...-to- silicon hybrid integration," ''Applied Physics A: Materials Science & Processing'' '''103''', 213-218, (2010). ...of the 36th International Conference on Acoustics, Speech'' ''and Signal Processing (IEEE)'', 2011. [UC San Diego]100 KB (14,246 words) - 16:34, 4 March 2020
- |Heterogeneous integration for optical signal processing |Roadmap on Optical Signal Processing submitted (2018).77 KB (11,491 words) - 16:10, 27 November 2019